EP20K400EFC672-3

IC FPGA 488 I/O 672FBGA
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 488 212992 16640 672-BBGA

Quantity 1,318 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BBGANumber of I/O488Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1664Number of Logic Elements/Cells16640
Number of Gates1052000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits212992

Overview of EP20K400EFC672-3 – APEX-20KE® Field Programmable Gate Array (FPGA) IC 488 212992 16640 672-BBGA

The EP20K400EFC672-3 is an APEX-20KE family field programmable gate array (FPGA) in a 672-ball BGA package. It integrates a MultiCore architecture with LUT-based logic and embedded system blocks (ESBs) to support register-intensive and memory-intensive functions on a single programmable device.

Designed for commercial applications, the device delivers up to 16,640 logic elements, approximately 0.213 Mbits of embedded memory, and 488 user I/O to address high-density logic, complex interfacing, and on-chip memory requirements while operating at a core supply range of 1.71 V to 1.89 V.

Key Features

  • MultiCore architecture & SOPC integration Integrated look-up table (LUT) logic and embedded system blocks (ESBs) enable combined logic and memory functions including FIFO, dual-port RAM, and CAM implementations.
  • Logic density 16,640 logic elements and approximately 1,052,000 system gates provide capacity for complex digital designs.
  • Embedded memory Approximately 0.213 Mbits of on-chip RAM (212,992 bits) for localized data storage and buffering without sacrificing logic resources.
  • I/O and interface flexibility 488 user I/O pins with MultiVolt I/O interface support for interfacing to a range of voltage domains and advanced I/O standards described in the APEX 20K family documentation.
  • Clock management Flexible clock circuitry including up to four phase-locked loops (PLLs), a low-skew clock tree, and programmable features such as ClockLock, ClockBoost, and ClockShift for precise clock control.
  • Low-voltage operation Core operating range specified at 1.71 V to 1.89 V supporting low-power designs; ESBs include programmable power-saving modes as described in family documentation.
  • Package & mounting 672-ball BGA (27 × 27 mm) surface-mount package suitable for compact, high-pin-count board designs.
  • Commercial temperature grade & compliance Rated for 0 °C to 85 °C operation and RoHS compliant.

Typical Applications

  • High-density logic processing Implement complex state machines, data path logic, and custom processing blocks leveraging 16,640 logic elements and on-chip RAM.
  • Memory interfacing and buffering Use embedded system blocks and ESB-based memory to build FIFOs, dual-port RAM, and memory controllers for external DDR or ZBT memories as supported by the APEX 20K family.
  • Communication and networking equipment Deploy the device for protocol bridging, packet processing, and I/O-heavy designs that require many configurable I/O pins and flexible clocking.
  • Prototyping and system integration Leverage SOPC-style integration to combine logic, memory, and peripheral interfacing in a single FPGA for rapid development and evaluation.

Unique Advantages

  • Highly integrated SOPC-capable architecture: Combines LUT logic with ESBs to implement both register-intensive and memory-intensive functions on-chip, reducing external component count.
  • Significant on-chip resources: 16,640 logic elements and roughly 1,052,000 system gates provide headroom for complex designs and growth.
  • Embedded memory for local buffering: Approximately 0.213 Mbits of RAM supports efficient data staging and FIFO implementations without using logic fabric.
  • Flexible clocking and timing control: Multiple PLLs, a low-skew clock tree, and programmable clock features enable precise timing architectures for synchronous systems.
  • Broad I/O compatibility: 488 user I/Os and MultiVolt interface support facilitate interfacing to a wide range of external devices and voltage domains.
  • Compact BGA packaging: 672-ball FBGA (27 × 27 mm) provides a high pin count in a compact surface-mount form factor for dense PCB layouts.

Why Choose EP20K400EFC672-3?

The EP20K400EFC672-3 positions itself as a high-capacity, commercially graded FPGA option within the APEX-20KE family, delivering a balance of logic density, embedded memory, and I/O flexibility for complex system designs. Its MultiCore architecture and ESB features enable integrated memory and logic functions, reducing external BOM and simplifying board-level design.

This device is well suited for engineering teams building commercial embedded systems, communication interfaces, and high-density prototyping platforms that require scalable logic resources, precise clock management, and a compact BGA package with RoHS compliance.

Request a quote or submit an inquiry to obtain pricing, lead time, and availability for the EP20K400EFC672-3.

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