EP20K400EFC672-3N

The EP20K400EFC672-3N is an APEX-20KE family field programmable gate array (FPGA) offered by Intel. It implements a MultiCore architecture that integrates look-up table (LUT) logic, product-term logic, and embedded memory, delivering a high-density, reprogrammable logic platform for complex digital designs.

Targeted at applications requiring substantial logic, memory and I/O resources, this device provides a combination of 16,640 logic elements, approximately 0.213 Mbits of embedded memory, and 488 I/O pins in a 672-BBGA package—addressing high-density system functions, memory interfacing, and multi‑domain clocking requirements.

Key Features

• High-density logic — 16,640 logic elements and 1,052,000 gates provide substantial programmable logic capacity for complex designs.
• Embedded memory — Approximately 0.213 Mbits (212,992 bits) of on-chip RAM suitable for FIFOs, dual-port RAM, and other memory functions.
• Robust I/O — 488 user I/O pins with MultiVolt I/O interface support for interfacing with multiple voltage domains.
• Flexible clock management — Family-level support for up to four PLLs and up to eight global clock signals, enabling multi-domain clocking and phase/clock-shift features.
• Advanced I/O capabilities — Family-level support includes high-speed standards and differential I/O (LVDS), and support for high-speed external memories such as DDR SDRAM and ZBT SRAM.
• Package and mounting — Surface-mount 672-BBGA package; supplier device package listed as 672-FBGA (27×27).
• Supply and temperature — Voltage supply range 1.71 V to 1.89 V and commercial operating temperature range 0 °C to 85 °C.
• Environmental — RoHS compliant.

Typical Applications

• Communications and Networking — Packet processing, protocol offload, and high-speed I/O aggregation using dense logic and extensive I/O resources.
• Memory Interface and Controllers — Implement controllers and buffering for DDR SDRAM and ZBT SRAM with on-chip RAM and high-speed I/O support.
• High‑performance Embedded Systems — Integrate custom datapaths, FIFOs and dual-port memories using embedded system blocks and abundant logic elements.
• Test & Measurement — Custom data acquisition, real-time signal routing, and protocol conversion leveraging flexible clocking and dense logic.

Unique Advantages

• Significant logic capacity: 16,640 logic elements and over one million gates enable large, integrated designs without immediate part changes.
• On-chip memory resources: Approximately 0.213 Mbits of embedded RAM reduce external memory dependence for FIFO and buffering needs.
• Wide I/O flexibility: 488 I/Os with MultiVolt interface support simplify interfacing to multiple voltage domains and legacy devices.
• Comprehensive clocking: Multiple PLLs and global clock resources support complex timing domains and phase management inside a single device.
• Commercial temperature and RoHS compliance: Commercial grade operation (0 °C to 85 °C) and RoHS compliance support common production and regulatory needs.

Why Choose EP20K400EFC672-3N?

The EP20K400EFC672-3N positions itself as a high-density, highly integrated FPGA option within the APEX-20KE family for designs that need substantial logic, embedded memory, and broad I/O capability in a single package. Its MultiCore architecture and family-level features for clock management and advanced I/O make it suitable for complex embedded systems, memory interfacing, and communications applications.

For engineering teams seeking scalability and a platform that supports memory-heavy and I/O-intensive functions, this device provides a balanced combination of programmable logic, embedded RAM, and configurable I/O in a 672-BBGA package from a recognized vendor.

Request a quote or submit your requirements to receive pricing and availability for the EP20K400EFC672-3N. Our team can help assess fit for your design and provide ordering details.