EP20K400FC672-1

The EP20K400FC672-1 is an APEX‑20K family FPGA in a 672‑BBGA package designed for commercial‑grade embedded logic applications. It implements a MultiCore architecture with LUT-based logic and embedded system blocks for memory and combinatorial functions, providing a programmable platform for system integration and custom digital designs.

With 16,640 logic elements, approximately 0.213 Mbits of embedded memory, 502 I/O pins and a maximum of 1,052,000 system gates, this device targets high‑I/O, memory‑intensive designs that require flexible clocking and advanced I/O capabilities.

Key Features

• Core Architecture MultiCore architecture combining look‑up table (LUT) logic and product‑term logic to support register‑intensive and combinatorial functions.
• Logic Capacity 16,640 logic elements and up to 1,052,000 system gates to implement complex custom logic and glue‑logic functions.
• Embedded Memory Approximately 0.213 Mbits of on‑chip RAM (212,992 bits) for FIFOs, dual‑port RAM, and other memory structures using embedded system blocks (ESBs).
• High‑Density I/O 502 user I/O pins to support wide parallel interfaces and high pin‑count system interconnects.
• Clock Management Flexible clock management features in the APEX‑20K family, including multiple PLLs, a low‑skew clock tree and programmable clock phase/delay functions for robust timing control.
• I/O Standards & Performance Family I/O features include support for high‑speed memory interfaces and differential signaling options, enabling DDR memory and high‑speed serial or parallel links in supported designs.
• Power & Voltage Internal/primary voltage supply range of 2.375 V to 2.625 V, with family support for MultiVolt I/O interfacing across common voltage domains.
• Package & Mounting 672‑BBGA (supplier package 672‑FBGA, 27×27 mm footprint) designed for surface mount assembly.
• Commercial Temperature Range Rated for 0 °C to 85 °C operating temperature and specified as Commercial grade.
• Standards & Design Support Family datasheet details support for industry interfaces and clock/I/O features that facilitate system‑level integration and peripheral connectivity.

Typical Applications

• High‑I/O System Interfaces Ideal for designs requiring wide parallel buses or many dedicated I/O lines—bridging peripherals, parallel memory interfaces, and custom I/O logic.
• Embedded Memory and Buffering Use embedded system blocks for FIFO buffering, dual‑port RAM, and small on‑chip storage in data flow and buffering applications.
• Custom Control & Glue Logic Implement microcontroller support logic, protocol translation, and system control functions where flexible combinational and registered logic is required.
• Prototyping & System Integration Suitable for prototyping system‑on‑chip concepts and integrating multiple functions into a single programmable device for rapid development.

Unique Advantages

• High Logic Density: 16,640 logic elements and over one million system gates enable complex logic implementations and consolidation of multiple functions into one device.
• Embedded Memory Resources: Approximately 0.213 Mbits of on‑chip RAM for efficient local storage and low‑latency buffering without external memory.
• Extensive I/O Count: 502 I/O pins provide design flexibility for multi‑channel interfaces, wide buses, and high‑pin‑count peripherals.
• Flexible Clocking: Family clock‑management features (including PLLs and programmable clock shifts) help meet timing requirements across complex designs.
• Commercial‑Grade Availability: Specified for 0 °C to 85 °C operation and supplied in a compact 672‑BBGA surface‑mount package to support standard commercial product environments.
• System Integration Ready: MultiCore architecture with LUTs and ESBs simplifies partitioning of logic and memory functions for integrated system designs.

Why Choose EP20K400FC672-1?

The EP20K400FC672-1 delivers a balance of logic capacity, embedded memory and high I/O density in a commercial‑grade APEX‑20K FPGA package. Its MultiCore architecture and ESB resources support mixed register‑ and memory‑centric functions, while family clock and I/O features enable robust system integration for memory interfaces and high‑I/O applications.

This device is well suited to designers seeking a programmable, high‑density solution for complex glue logic, buffering and interface tasks where commercial operating temperature and a compact 672‑BBGA footprint are required. The device’s resource mix provides a scalable platform for consolidating multiple functions and shortening development cycles.

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