EP20K400FC672-1X

IC FPGA 502 I/O 672FBGA
Part Description

APEX-20K® Field Programmable Gate Array (FPGA) IC 502 212992 16640 672-BBGA

Quantity 702 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BBGANumber of I/O502Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1664Number of Logic Elements/Cells16640
Number of Gates1052000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits212992

Overview of EP20K400FC672-1X – APEX-20K® FPGA, 672-BBGA

The EP20K400FC672-1X is an APEX-20K® field programmable gate array (FPGA) in a 672-ball BGA package designed for high-density, embedded-logic designs. It combines MultiCore architecture with look-up table (LUT) logic and embedded system blocks (ESBs) to consolidate logic and memory functions in a single device.

This device targets commercial applications that require substantial logic capacity, significant on-chip memory, and a large I/O complement for complex board-level integration, memory interfaces, and peripheral interconnects.

Key Features

  • Logic Capacity — 16,640 logic elements (LEs) providing approximately 1,052,000 gates for high-density logic implementation.
  • Embedded Memory — Approximately 0.213 Mbits of embedded memory (212,992 total RAM bits) implemented via ESBs for FIFOs, dual-port RAM and CAM-style functions.
  • I/O Scale and Flexibility — 502 user I/O pins to support wide board-level connectivity and complex interfaces.
  • Advanced I/O Standards — MultiVolt I/O interface support and documented compatibility with high-speed memory interfaces including DDR SDRAM and ZBT SRAM, plus support for LVDS and other high-speed signaling modes as described in the APEX-20K family data.
  • Clock Management — Flexible clock resources including up to four PLLs and up to eight global clock signals, with features for clock phase and delay control.
  • Power and Supply — Internal supply operation in the APEX-20K family and device-level voltage supply range of 2.375 V to 2.625 V per product specifications.
  • Package and Mounting — Surface-mount 672-BBGA package (supplier package: 672-FBGA, 27 × 27 mm) suitable for compact board layouts.
  • Commercial Temperature Grade — Rated for 0 °C to 85 °C operating temperature and RoHS compliant.

Typical Applications

  • High-speed memory interfaces — Implement DDR SDRAM and ZBT SRAM controllers and bridges using the device’s embedded memory and high-speed I/O support.
  • PCI and peripheral connectivity — Support PCI Local Bus topologies at 3.3 V (per APEX-20K family notes) for host and peripheral interfacing.
  • Communications and data aggregation — Use the device’s large I/O count and LVDS-capable signaling for multi-channel data capture and aggregation tasks.
  • Embedded system integration — Combine LUT logic and ESBs to implement on-chip FIFOs, dual-port RAM, and system functions for SOPC-style designs.

Unique Advantages

  • High integration density: 16,640 logic elements and roughly 1,052,000 gates reduce the need for multiple devices when consolidating complex logic and memory functions.
  • On-chip memory versatility: Approximately 0.213 Mbits of embedded RAM in ESBs supports FIFO, dual-port RAM and CAM implementations, simplifying board-level memory design.
  • Large I/O footprint: 502 user I/O pins enable extensive peripheral and bus connectivity without external I/O expanders.
  • Flexible clocking: Multiple PLLs and global clock resources provide deterministic clock distribution and phase/delay control for timing-sensitive designs.
  • Commercial-grade reliability: Designed for commercial temperature operation (0 °C to 85 °C) and RoHS compliance for regulatory alignment.

Why Choose EP20K400FC672-1X?

The EP20K400FC672-1X positions itself as a high-density, highly integrated FPGA option within the APEX-20K family, delivering substantial logic resources, embedded memory, and a wide I/O complement in a compact 672-BBGA package. Its MultiCore architecture and ESB-based memory/functions provide designers with on-chip building blocks suitable for memory-intensive and connectivity-rich commercial systems.

This device is well suited for engineering teams building complex boards that require consolidated logic, flexible I/O standards, and deterministic clocking. The combination of logic capacity, embedded RAM, and commercial temperature rating provides a reliable platform for scalable designs with strong ecosystem and documentation from the APEX-20K family.

Request a quote or submit a pricing inquiry to evaluate the EP20K400FC672-1X for your next commercial FPGA design project.

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