EP20K400FC672-1X
| Part Description |
APEX-20K® Field Programmable Gate Array (FPGA) IC 502 212992 16640 672-BBGA |
|---|---|
| Quantity | 702 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA | Number of I/O | 502 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1664 | Number of Logic Elements/Cells | 16640 | ||
| Number of Gates | 1052000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 212992 |
Overview of EP20K400FC672-1X – APEX-20K® FPGA, 672-BBGA
The EP20K400FC672-1X is an APEX-20K® field programmable gate array (FPGA) in a 672-ball BGA package designed for high-density, embedded-logic designs. It combines MultiCore architecture with look-up table (LUT) logic and embedded system blocks (ESBs) to consolidate logic and memory functions in a single device.
This device targets commercial applications that require substantial logic capacity, significant on-chip memory, and a large I/O complement for complex board-level integration, memory interfaces, and peripheral interconnects.
Key Features
- Logic Capacity — 16,640 logic elements (LEs) providing approximately 1,052,000 gates for high-density logic implementation.
- Embedded Memory — Approximately 0.213 Mbits of embedded memory (212,992 total RAM bits) implemented via ESBs for FIFOs, dual-port RAM and CAM-style functions.
- I/O Scale and Flexibility — 502 user I/O pins to support wide board-level connectivity and complex interfaces.
- Advanced I/O Standards — MultiVolt I/O interface support and documented compatibility with high-speed memory interfaces including DDR SDRAM and ZBT SRAM, plus support for LVDS and other high-speed signaling modes as described in the APEX-20K family data.
- Clock Management — Flexible clock resources including up to four PLLs and up to eight global clock signals, with features for clock phase and delay control.
- Power and Supply — Internal supply operation in the APEX-20K family and device-level voltage supply range of 2.375 V to 2.625 V per product specifications.
- Package and Mounting — Surface-mount 672-BBGA package (supplier package: 672-FBGA, 27 × 27 mm) suitable for compact board layouts.
- Commercial Temperature Grade — Rated for 0 °C to 85 °C operating temperature and RoHS compliant.
Typical Applications
- High-speed memory interfaces — Implement DDR SDRAM and ZBT SRAM controllers and bridges using the device’s embedded memory and high-speed I/O support.
- PCI and peripheral connectivity — Support PCI Local Bus topologies at 3.3 V (per APEX-20K family notes) for host and peripheral interfacing.
- Communications and data aggregation — Use the device’s large I/O count and LVDS-capable signaling for multi-channel data capture and aggregation tasks.
- Embedded system integration — Combine LUT logic and ESBs to implement on-chip FIFOs, dual-port RAM, and system functions for SOPC-style designs.
Unique Advantages
- High integration density: 16,640 logic elements and roughly 1,052,000 gates reduce the need for multiple devices when consolidating complex logic and memory functions.
- On-chip memory versatility: Approximately 0.213 Mbits of embedded RAM in ESBs supports FIFO, dual-port RAM and CAM implementations, simplifying board-level memory design.
- Large I/O footprint: 502 user I/O pins enable extensive peripheral and bus connectivity without external I/O expanders.
- Flexible clocking: Multiple PLLs and global clock resources provide deterministic clock distribution and phase/delay control for timing-sensitive designs.
- Commercial-grade reliability: Designed for commercial temperature operation (0 °C to 85 °C) and RoHS compliance for regulatory alignment.
Why Choose EP20K400FC672-1X?
The EP20K400FC672-1X positions itself as a high-density, highly integrated FPGA option within the APEX-20K family, delivering substantial logic resources, embedded memory, and a wide I/O complement in a compact 672-BBGA package. Its MultiCore architecture and ESB-based memory/functions provide designers with on-chip building blocks suitable for memory-intensive and connectivity-rich commercial systems.
This device is well suited for engineering teams building complex boards that require consolidated logic, flexible I/O standards, and deterministic clocking. The combination of logic capacity, embedded RAM, and commercial temperature rating provides a reliable platform for scalable designs with strong ecosystem and documentation from the APEX-20K family.
Request a quote or submit a pricing inquiry to evaluate the EP20K400FC672-1X for your next commercial FPGA design project.

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