EP20K400FC672-2

IC FPGA 502 I/O 672FBGA
Part Description

APEX-20K® Field Programmable Gate Array (FPGA) IC 502 212992 16640 672-BBGA

Quantity 207 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BBGANumber of I/O502Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1664Number of Logic Elements/Cells16640
Number of Gates1052000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits212992

Overview of EP20K400FC672-2 – APEX-20K® Field Programmable Gate Array (FPGA) IC, 672-BBGA

The EP20K400FC672-2 is an APEX-20K family field programmable gate array from Intel, built around the MultiCore architecture to combine lookup-table logic, product-term logic and embedded memory. With 16,640 logic elements and approximately 0.213 Mbits (212,992 bits) of embedded RAM, it is designed for complex system integration tasks that require moderate to high logic density and flexible I/O.

Targeted for commercial applications, this surface-mount FPGA in a 672-BBGA (27×27) package offers a balance of logic capacity, on-chip memory and up to 502 user I/O pins, making it suitable for multi-function digital designs and SOPC (system-on-a-programmable-chip) implementations.

Key Features

  • Core Logic 16,640 logic elements and approximately 1,052,000 system gates provide substantial combinatorial and register resources for mid-to-high complexity digital designs.
  • Embedded Memory (ESBs) Approximately 0.213 Mbits (212,992 bits) of embedded RAM that can be used for FIFOs, dual-port RAM or CAM-style functions as part of the MultiCore architecture.
  • I/O and Interfaces Up to 502 user I/O pins with MultiVolt I/O support for multiple signaling levels; programmable slew-rate control, per-pin tri-state enable and pull-up on I/O during configuration enhance interface flexibility.
  • Clock Management Flexible clocking with support for up to four PLLs, a low-skew clock tree and multiple global clocks to simplify timing distribution and clock domain management.
  • Power Internal supply voltage support consistent with APEX-20K family options and device VCCIO range; specified operating supply for this device is 2.375 V to 2.625 V.
  • Package & Mounting 672-ball BGA package (672-FBGA, 27×27) for surface-mount assembly, suitable for compact board layouts where high pin-count and density are required.
  • Commercial Temperature Range Rated for 0 °C to 85 °C operating temperature, appropriate for commercial applications.
  • Compliance RoHS compliant.

Typical Applications

  • System Integration / SOPC Use the MultiCore architecture and embedded memory to consolidate multiple system functions into a single FPGA for compact system-on-chip designs.
  • High-speed Interface Bridging Leverage the extensive I/O set and MultiVolt support to implement protocol bridging and interface translation between disparate voltage domains.
  • Memory Interface Controllers Implement DDR or other external memory controllers using the device’s embedded RAM and dedicated interconnect resources to handle buffering and timing requirements.
  • Custom Logic and Prototyping Deploy the device for mid-to-high density custom logic, signal processing pipelines, and hardware prototyping requiring up to 16,640 logic elements.

Unique Advantages

  • Highly integrated MultiCore architecture: Combines LUT-based logic, product-term logic and embedded system blocks for flexible partitioning of logic and memory functions.
  • Substantial logic and gate capacity: 16,640 logic elements and approximately 1,052,000 gates enable implementation of complex digital systems without excessive external ASIC or CPLD reliance.
  • Generous on-chip RAM: Approximately 0.213 Mbits of embedded memory supports FIFOs, dual-port RAM and other buffering needs directly on-chip.
  • Extensive, flexible I/O: Up to 502 I/O pins with programmable I/O features and MultiVolt support simplify integration with a wide range of peripherals and voltage domains.
  • Robust clock resources: Multiple PLLs and a low-skew clock tree provide deterministic clocking and phase control for multi-domain timing requirements.
  • Commercial-ready package: 672-BBGA surface-mount package offers high pin density for compact board layouts while supporting commercial temperature operation.

Why Choose EP20K400FC672-2?

The EP20K400FC672-2 positions itself as a versatile APEX-20K FPGA option for commercial designs that require a combination of significant logic capacity, embedded RAM and broad I/O flexibility. Its MultiCore architecture and on-chip resources let engineers consolidate functions, streamline board-level integration and manage multiple clock domains effectively.

This device is well suited to engineering teams building mid-to-high complexity digital systems, interface controllers, and SOPC-based applications who need a commercially-rated FPGA with a balanced mix of logic, memory and I/O in a compact 672-BBGA footprint.

Request a quote or submit an inquiry to receive pricing, availability and additional technical support for the EP20K400FC672-2.

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