EP20K400EFI672-2X

The EP20K400EFI672-2X is an APEX-20KE® family FPGA delivering a high-density, system-oriented programmable logic solution. It combines MultiCore architecture elements—look-up table (LUT) logic, product-term logic, and embedded system blocks (ESBs)—with a substantial logic and memory footprint for mid-to-high complexity designs.

Designed for surface-mount applications, this device provides 16,640 logic elements, approximately 0.213 Mbits of embedded memory (212,992 bits), and 488 user I/O pins in a 672-BBGA package, making it suitable for industrial-temperature designs that require dense integration and flexible I/O and clock management.

Key Features

• Core density  16,640 logic elements and approximately 1,052,000 gates provide significant on-chip logic capacity for complex glue logic, protocol handling, and custom processing blocks.
• Embedded memory  Approximately 0.213 Mbits (212,992 bits) of on-chip RAM implemented via ESBs for FIFOs, dual-port RAMs, and other memory structures.
• Flexible I/O  488 user I/O pins with MultiVolt I/O interface support enable interfacing across 1.8 V–5.0 V domains (series-level capability) and support for advanced I/O standards and high-speed signaling.
• Clock management  Integrated clock resources including up to four PLLs, a built-in low-skew clock tree and multiple global clock signals to simplify timing distribution and enable clock multiplication, division, and phase shifting.
• Low-power design  Device and ESB features support power-saving modes; specified internal voltage supply range is 1.71 V to 1.89 V for the device core.
• Package & mounting  672-BBGA (supplier package: 672-FBGA, 27×27) in a surface-mount form factor suitable for compact board designs.
• Industrial temperature grade  Rated for operation from −40 °C to 100 °C to meet demanding environmental requirements.
• Standards and memory interface support  Series-level support includes compliance options for PCI Local Bus (3.3 V operation) and interfaces for high-speed external memories such as DDR SDRAM and ZBT SRAM.
• RoHS compliant  Conforms to RoHS requirements for environmental compliance.

Typical Applications

• High-speed memory controllers  Implement DDR SDRAM or ZBT SRAM interfaces and buffering logic using on-chip ESBs and abundant logic elements.
• Industrial control and automation  Use the device’s industrial temperature range, large logic capacity, and flexible I/O to implement motor control, sensor aggregation, and real-time control logic.
• Data acquisition and signal conditioning  Leverage dense logic and fast I/O to perform protocol translation, preprocessing, and aggregation of high-speed data streams.
• Interface bridging and protocol conversion  Use available logic resources and MultiVolt I/O to bridge between different bus standards and voltage domains, including PCI 3.3 V operation where applicable.

Unique Advantages

• High integration density: 16,640 logic elements and roughly 1,052,000 gates enable consolidation of multiple functions into a single device, reducing board-level BOM and interconnect complexity.
• Embedded system blocks (ESBs): Provide on-chip RAM and FIFO capability, simplifying memory-intensive designs without external components.
• Robust clock resources: Up to four PLLs and a low-skew clock tree streamline clocking for multi-domain designs and high-speed interfaces.
• Broad I/O flexibility: 488 I/Os with MultiVolt support facilitate mixed-voltage interfacing and diverse peripheral connectivity.
• Industrial-ready thermal range: Specified for −40 °C to 100 °C operation to support harsh-environment deployments.
• Compact BGA package: 672-BBGA (27×27) surface-mount package balances lead-pin density with board space savings for compact systems.

Why Choose EP20K400EFI672-2X?

The EP20K400EFI672-2X positions itself as a high-density, industrial-temperature APEX-20KE® FPGA option for designers who need substantial on-chip logic and embedded memory in a compact surface-mount package. Its combination of 16,640 logic elements, significant ESB-based RAM, extensive I/O, and flexible clock management addresses a broad set of mid-to-high complexity system requirements.

This device is suitable for engineers looking to consolidate logic, implement advanced memory interfaces, and manage multiple clock domains while maintaining a small PCB footprint and industrial temperature capability. The platform-level features and RoHS compliance support longer-term design stability and regulatory considerations.

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