EP20K400EFC672-1XN

IC FPGA 488 I/O 672FBGA
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 488 212992 16640 672-BBGA

Quantity 95 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BBGANumber of I/O488Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1664Number of Logic Elements/Cells16640
Number of Gates1052000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits212992

Overview of EP20K400EFC672-1XN – APEX-20KE® Field Programmable Gate Array (FPGA) IC 488 212992 16640 672-BBGA

The EP20K400EFC672-1XN is an APEX-20KE family field programmable gate array (FPGA) in a 672-ball BGA package, designed for high-density, system-level programmable logic. It combines MultiCore architecture with look-up table (LUT) logic and embedded system blocks (ESBs) to implement register-intensive functions, memory structures and product-term logic on a single device.

With 16,640 logic elements, approximately 0.213 Mbits of embedded memory and 488 user I/Os, this device targets complex embedded systems, high-density logic integration and I/O-rich applications where integration, predictable timing and low-power operation are required.

Key Features

  • MultiCore architecture and LUT logic  MultiCore architecture integrating LUT logic and product-term logic for register- and combinatorial-intensive functions.
  • Embedded system blocks (ESBs)  ESBs provide on-chip memory functions such as FIFO buffers, dual-port RAM and content-addressable memory (CAM); ESBs also support programmable power-saving modes.
  • Logic and capacity  16,640 logic elements and approximately 1,052,000 system gates provide high-density programmable logic resources.
  • On-chip memory  Approximately 212,992 bits of embedded RAM for data buffering and local storage.
  • I/O and interfacing  488 user I/Os with MultiVolt I/O interface support for interfacing with 1.8 V, 2.5 V, 3.3 V and 5.0 V signals; family-level support includes standards such as LVDS and PCI (3.3 V operation).
  • Clock management  Flexible clocking with support for multiple PLLs, a built-in low-skew clock tree and features for clock multiplication, division and phase shifting (ClockBoost, ClockShift, ClockLock).
  • Power and supply  Designed for low-power operation; internal supply voltage specified at 1.71 V to 1.89 V for this device.
  • Package and mounting  672-ball BGA (supplier device package 672-FBGA, 27 × 27 mm), surface-mount package optimized for compact board-level integration.
  • Commercial temperature grade  Rated for 0 °C to 85 °C operating temperature.
  • Regulatory  RoHS-compliant.

Typical Applications

  • Embedded systems  Implement control logic, protocol processing and custom accelerators using the device’s LUT-rich fabric and on-chip ESB memory.
  • High-speed I/O and protocol bridges  Use the device’s 488 I/Os and MultiVolt I/O support to interface between diverse voltage domains and bus standards, including family-level support for PCI and LVDS.
  • Memory interfacing and buffering  On-chip ESBs and support for external memory types enable robust FIFO, dual-port RAM and DDR/ZBT memory interface designs.
  • Data-path processing  Leverage 16,640 logic elements and dedicated clock-management features to implement data-path functions, pipelining and timing-critical logic.

Unique Advantages

  • High integration density: 16,640 logic elements and roughly 1,052,000 system gates reduce the need for multiple discrete devices in complex designs.
  • On-chip memory for system functions: Approximately 212,992 bits of embedded RAM and ESB-based FIFOs/dual-port RAM simplify buffering and local storage without external components.
  • Flexible I/O support: 488 I/Os with MultiVolt compatibility enable direct interfacing across common logic voltage levels for diverse system buses and peripherals.
  • Advanced clocking capabilities: Multiple PLLs and programmable clock features provide low-skew, phase and frequency control for synchronous, timing-sensitive designs.
  • Compact, surface-mount BGA package: 672-BBGA (672-FBGA 27×27) delivers high pin-count in a compact footprint suitable for space-constrained boards.
  • Commercial-grade reliability: Specified for 0 °C to 85 °C operation and RoHS-compliant manufacturing.

Why Choose EP20K400EFC672-1XN?

The EP20K400EFC672-1XN positions itself as a high-density, feature-rich programmable logic device within the APEX-20KE family. With 16,640 logic elements, substantial on-chip RAM and 488 I/Os in a compact 672-ball BGA, it is suited to designers needing integrated memory, flexible I/O and advanced clock control in commercially rated systems.

This device is well suited to engineering teams building embedded controllers, protocol interfaces and data-path accelerators that benefit from on-chip FIFOs, dual-port RAM and MultiVolt I/O. Its combination of logic capacity, embedded memory and clock-management features provides a scalable platform for medium- to high-complexity FPGA designs backed by the APEX-20K family feature set.

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