EP20K400EFC672-1XN
| Part Description |
APEX-20KE® Field Programmable Gate Array (FPGA) IC 488 212992 16640 672-BBGA |
|---|---|
| Quantity | 95 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA | Number of I/O | 488 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1664 | Number of Logic Elements/Cells | 16640 | ||
| Number of Gates | 1052000 | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 212992 |
Overview of EP20K400EFC672-1XN – APEX-20KE® Field Programmable Gate Array (FPGA) IC 488 212992 16640 672-BBGA
The EP20K400EFC672-1XN is an APEX-20KE family field programmable gate array (FPGA) in a 672-ball BGA package, designed for high-density, system-level programmable logic. It combines MultiCore architecture with look-up table (LUT) logic and embedded system blocks (ESBs) to implement register-intensive functions, memory structures and product-term logic on a single device.
With 16,640 logic elements, approximately 0.213 Mbits of embedded memory and 488 user I/Os, this device targets complex embedded systems, high-density logic integration and I/O-rich applications where integration, predictable timing and low-power operation are required.
Key Features
- MultiCore architecture and LUT logic MultiCore architecture integrating LUT logic and product-term logic for register- and combinatorial-intensive functions.
- Embedded system blocks (ESBs) ESBs provide on-chip memory functions such as FIFO buffers, dual-port RAM and content-addressable memory (CAM); ESBs also support programmable power-saving modes.
- Logic and capacity 16,640 logic elements and approximately 1,052,000 system gates provide high-density programmable logic resources.
- On-chip memory Approximately 212,992 bits of embedded RAM for data buffering and local storage.
- I/O and interfacing 488 user I/Os with MultiVolt I/O interface support for interfacing with 1.8 V, 2.5 V, 3.3 V and 5.0 V signals; family-level support includes standards such as LVDS and PCI (3.3 V operation).
- Clock management Flexible clocking with support for multiple PLLs, a built-in low-skew clock tree and features for clock multiplication, division and phase shifting (ClockBoost, ClockShift, ClockLock).
- Power and supply Designed for low-power operation; internal supply voltage specified at 1.71 V to 1.89 V for this device.
- Package and mounting 672-ball BGA (supplier device package 672-FBGA, 27 × 27 mm), surface-mount package optimized for compact board-level integration.
- Commercial temperature grade Rated for 0 °C to 85 °C operating temperature.
- Regulatory RoHS-compliant.
Typical Applications
- Embedded systems Implement control logic, protocol processing and custom accelerators using the device’s LUT-rich fabric and on-chip ESB memory.
- High-speed I/O and protocol bridges Use the device’s 488 I/Os and MultiVolt I/O support to interface between diverse voltage domains and bus standards, including family-level support for PCI and LVDS.
- Memory interfacing and buffering On-chip ESBs and support for external memory types enable robust FIFO, dual-port RAM and DDR/ZBT memory interface designs.
- Data-path processing Leverage 16,640 logic elements and dedicated clock-management features to implement data-path functions, pipelining and timing-critical logic.
Unique Advantages
- High integration density: 16,640 logic elements and roughly 1,052,000 system gates reduce the need for multiple discrete devices in complex designs.
- On-chip memory for system functions: Approximately 212,992 bits of embedded RAM and ESB-based FIFOs/dual-port RAM simplify buffering and local storage without external components.
- Flexible I/O support: 488 I/Os with MultiVolt compatibility enable direct interfacing across common logic voltage levels for diverse system buses and peripherals.
- Advanced clocking capabilities: Multiple PLLs and programmable clock features provide low-skew, phase and frequency control for synchronous, timing-sensitive designs.
- Compact, surface-mount BGA package: 672-BBGA (672-FBGA 27×27) delivers high pin-count in a compact footprint suitable for space-constrained boards.
- Commercial-grade reliability: Specified for 0 °C to 85 °C operation and RoHS-compliant manufacturing.
Why Choose EP20K400EFC672-1XN?
The EP20K400EFC672-1XN positions itself as a high-density, feature-rich programmable logic device within the APEX-20KE family. With 16,640 logic elements, substantial on-chip RAM and 488 I/Os in a compact 672-ball BGA, it is suited to designers needing integrated memory, flexible I/O and advanced clock control in commercially rated systems.
This device is well suited to engineering teams building embedded controllers, protocol interfaces and data-path accelerators that benefit from on-chip FIFOs, dual-port RAM and MultiVolt I/O. Its combination of logic capacity, embedded memory and clock-management features provides a scalable platform for medium- to high-complexity FPGA designs backed by the APEX-20K family feature set.
Request a quote or contact sales to discuss availability, pricing and lead time for EP20K400EFC672-1XN.

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