EP20K400EFC672-1

IC FPGA 488 I/O 672FBGA
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 488 212992 16640 672-BBGA

Quantity 1,026 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BBGANumber of I/O488Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1664Number of Logic Elements/Cells16640
Number of Gates1052000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits212992

Overview of EP20K400EFC672-1 – APEX-20KE Field Programmable Gate Array, 672‑BBGA

The EP20K400EFC672-1 is an APEX-20KE family field programmable gate array (FPGA) offered in a 672‑BBGA surface-mount package. It implements a MultiCore architecture that integrates look-up table (LUT) logic, product-term logic, and embedded system blocks for on-chip memory functions.

Designed for high-density, I/O-rich designs, this commercial-grade FPGA provides a balance of logic capacity, embedded memory, flexible clock management and multi-voltage I/O to support system integration, memory buffering and high-bandwidth interface tasks.

Key Features

  • Core architecture  MultiCore architecture integrating LUT logic, product-term logic, and embedded system blocks (ESBs) for register- and memory-centric functions.
  • Logic capacity  16,640 logic elements and up to 1,052,000 system gates (device data lists both typical and maximum gate figures), enabling complex logic integration on a single device.
  • Embedded memory  Approximately 0.213 Mbits of on-chip RAM (212,992 bits) with ESB support for FIFO buffers, dual-port RAM and content-addressable memory (CAM) implementations.
  • I/O and interface flexibility  488 user I/O pins and MultiVolt I/O interface support for 1.8 V, 2.5 V, 3.3 V and 5.0 V signaling options; family features include support for LVDS, PCI and high-speed external memory interfaces.
  • Clock management  Flexible clock resources including up to four PLLs, a low-skew clock tree, up to eight global clock signals, and features such as ClockLock, ClockBoost and ClockShift for programmable clock phase and delay control.
  • Power and supply  Internal supply range 1.71 V to 1.89 V (1.8 V nominal) and ESB programmable power-saving mode; APEX 20K family is designed with low-power operation in mind.
  • Package and thermal  Surface-mount 672‑BBGA (supplier package: 672‑FBGA, 27×27) in a commercial-grade offering with operating temperature range 0 °C to 85 °C.
  • Compliance  RoHS compliant.

Typical Applications

  • Embedded system integration  Implement system-on-a-programmable-chip (SOPC) designs using integrated LUT logic and ESBs for on-chip memory and buffering.
  • Memory interface and buffering  Implement DDR SDRAM or ZBT SRAM interfaces and on-chip FIFOs or dual-port RAM using the ESB memory resources.
  • High‑bandwidth I/O and communications  Support for LVDS channels and PCI-class signaling makes the device suitable for designs requiring high-speed serial or parallel connectivity.
  • Custom logic and prototyping  High logic element count and substantial embedded memory capacity allow consolidation of complex custom logic and rapid prototyping on a single FPGA.

Unique Advantages

  • Highly integrated MultiCore design: Consolidates LUT, product-term logic and embedded memory to reduce external component count.
  • Significant logic and memory capacity: 16,640 logic elements and approximately 0.213 Mbits of embedded RAM support sizeable, stateful designs on-chip.
  • High I/O density with MultiVolt support: 488 I/O pins and multi-voltage I/O interface options simplify board-level signaling across different voltage domains.
  • Advanced clocking features: Multiple PLLs, low-skew clock tree and programmable clock controls provide timing flexibility for synchronous systems.
  • Compact BGA footprint: 672‑BBGA (27×27) surface-mount package enables dense PCB integration without sacrificing connectivity.
  • Commercial-grade and RoHS compliant: Designed for commercial applications with environmental compliance for restricted substances.

Why Choose EP20K400EFC672-1?

The EP20K400EFC672-1 positions itself as a high-density, I/O-capable FPGA for commercial applications that need integrated logic, on-chip memory and flexible clocking. With 16,640 logic elements, substantial embedded RAM, and nearly 500 I/O pins, it is suited to designs that consolidate memory buffering, protocol interfacing and custom logic into a single programmable device.

Choose this APEX-20KE device when your project requires a balance of logic capacity, embedded memory resources and multi-voltage I/O in a compact BGA package for streamlined board design and system integration.

Request a quote or submit an inquiry to receive availability and pricing information for EP20K400EFC672-1.

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