EP4S40G5H40I1G

IC FPGA 654 I/O 1517HBGA
Part Description

Field Programmable Gate Array (FPGA) IC

Quantity 1,564 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1517-HBGA (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O654Voltage920 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs21248Number of Logic Elements/Cells531200
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits28033024

Overview of EP4S40G5H40I1G – Field Programmable Gate Array (FPGA) IC

The EP4S40G5H40I1G is an Intel Field Programmable Gate Array (FPGA) IC. It is presented within the Stratix IV device family and provides a high-density programmable fabric with 531,200 logic elements, approximately 28 Mbits of embedded memory, and 654 I/Os for system integration.

Designed for demanding industrial applications, the device is surface-mount packaged (1517-HBGA / 1517-BBGA FCBGA options), operates from a core supply of 0.920–0.980 V, and is specified for an operating temperature range of −40 °C to 100 °C. Series-level Stratix IV features include high-speed transceivers, DSP resources, flexible clock networks and PLLs to support high-bandwidth designs and diverse protocol support.

Key Features

  • Core and Logic High-density programmable fabric with 531,200 logic elements to implement complex digital systems and custom logic functions.
  • Embedded Memory Approximately 28 Mbits of on-chip RAM for buffering, packet storage, and local data working sets.
  • I/O Capacity 654 available I/Os to support broad peripheral and bus connectivity; suitable for multi-channel interfacing in constrained board layouts.
  • High-Speed Transceivers & Protocol Support Stratix IV family features include high-speed transceiver capability and support for a wide range of protocols, enabling high-throughput serial links and protocol handling.
  • DSP Blocks, Clock Networks and PLLs Device-family architecture includes dedicated DSP resources and flexible clocking (clock networks and PLLs) to support low-latency signal processing and synchronized multi-domain designs.
  • Package & Mounting Surface-mount FCBGA packages (1517-HBGA / 1517-BBGA, 45×45 mm footprint) for reliable board-level integration and thermal performance.
  • Power Core voltage supply specified at 0.920–0.980 V to match system power-domain requirements.
  • Industrial Temperature Grade Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
  • Environmental Compliance RoHS compliant, meeting common materials and environmental requirements for electronic assemblies.

Typical Applications

  • High‑Speed Communications Use the device-family transceiver capabilities and abundant logic to implement protocol processing, packet handling and serial link aggregation.
  • Network and Data‑Plane Processing Large logic capacity and on-chip memory enable hardware acceleration of switching, routing, and data-plane functions.
  • Digital Signal Processing DSP blocks and flexible clocking make the device suitable for real-time signal processing, filtering and algorithm acceleration.
  • Industrial Control and Automation Industrial temperature rating and extensive I/O facilitate sensor interfacing, motor control logic and deterministic control systems.

Unique Advantages

  • High Logic Density: 531,200 logic elements provide the capacity to implement large-scale custom logic and multi-function designs on a single device.
  • Substantial On‑Chip Memory: Approximately 28 Mbits of embedded RAM reduces external memory dependence and accelerates data-path operations.
  • Extensive I/O Count: 654 I/Os allow flexible connectivity for multi-channel systems and complex board-level interfaces.
  • Industrial Reliability: Specified for −40 °C to 100 °C operation, enabling deployment in industrial environments with wide temperature swings.
  • System Integration: Stratix IV family features—high-speed transceivers, DSP resources, clock networks and PLLs—help consolidate functions and reduce external IP or discrete components.
  • Standard Surface‑Mount Packaging: 1517-HBGA / 1517-BBGA FCBGA formats provide a compact, manufacturable footprint for high-density board designs.

Why Choose EP4S40G5H40I1G?

EP4S40G5H40I1G combines high logic density, significant embedded memory and a large I/O complement in a Stratix IV device-family implementation, making it suitable for designs that require integrated processing, high bandwidth and robust industrial operation. Its package and power characteristics are specified to support production-grade surface-mount assembly and system power planning.

Engineers and procurement teams targeting industrial applications or complex data- and signal-processing tasks will find the device suited to scalable, high-performance implementations. The part is documented within the Stratix IV device handbook for series-level design guidance and integration details.

Request a quote or submit a sales inquiry for pricing and availability of EP4S40G5H40I1G to begin evaluating this FPGA for your next design.

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