EP4S40G5H40I1N

The EP4S40G5H40I1N is a STRATIX® IV GT Field Programmable Gate Array (FPGA) in a 1517-BBGA FCBGA package from Intel. It provides a high-density programmable fabric combined with substantial embedded memory and a large number of I/O pins for complex system designs.

With 531,200 logic elements, approximately 28 Mbits of on-chip RAM and 654 I/Os, this device targets designs that require significant logic capacity, abundant memory resources and extensive external interfacing, while supporting industrial temperature operation and RoHS compliance.

Key Features

• Core FPGA Architecture  STRATIX® IV GT family FPGA in a field-programmable architecture suitable for complex digital logic implementation.
• Logic Capacity  531,200 logic elements to support high-density logic designs and large-scale integration of digital functions.
• On‑Chip Memory  Approximately 28 Mbits of embedded memory to support buffering, data storage and local processing needs.
• I/O Resources  654 I/O pins provide broad external connectivity for sensors, peripherals and high-pin-count interfaces.
• Package and Mounting  1517-BBGA, FCBGA package (supplier device package 1517-HBGA, 42.5×42.5 mm) designed for surface mount assembly in compact layouts.
• Power Requirements  Core voltage supply range 920 mV to 980 mV for power planning and supply design.
• Operating Range  Industrial-grade operation with an ambient temperature range from 0 °C to 100 °C.
• Compliance  RoHS compliant for environmental and regulatory considerations.

Typical Applications

• High‑density digital systems  Implement complex state machines, datapaths and custom processing using the device's 531,200 logic elements and embedded memory.
• I/O‑intensive platforms  Use the 654 I/Os to connect multiple external devices, sensors and interfaces without extensive external glue logic.
• Industrial control and automation  Industrial-grade rating and 0 °C–100 °C operating range support deployment in factory-floor controllers, machine automation and process control equipment.
• Compact, high‑density PCBs  The 1517-BBGA FCBGA package enables integration into space-constrained boards where high logic density is required.

Unique Advantages

• Large logic resource pool: 531,200 logic elements allow consolidation of multiple functions into a single device, reducing system partitioning and BOM complexity.
• Substantial embedded memory: Approximately 28 Mbits of on-chip RAM supports local buffering and data processing, lowering the need for external memory.
• Extensive external connectivity: 654 I/Os provide flexibility to interface with many peripherals and sensors directly, simplifying board-level design.
• Industrial-rated operation: 0 °C–100 °C operating range aligns with industrial application requirements for reliable field operation.
• Space-efficient packaging: 1517-BBGA FCBGA (1517-HBGA, 42.5×42.5 mm) enables high-density board layouts while maintaining surface mount assembly compatibility.
• Defined core voltage range: 920 mV–980 mV supply specification assists in precise power supply selection and thermal planning.

Why Choose EP4S40G5H40I1N?

The EP4S40G5H40I1N strikes a balance between high logic capacity, abundant embedded memory and extensive I/O resources in a compact FCBGA package. Its industrial-grade operating range and RoHS compliance make it suitable for long-term deployment in demanding commercial and industrial applications.

This part is appropriate for engineering teams building complex digital systems that require consolidation of functions, significant on-chip buffering and broad external interfacing, while maintaining controlled power and packaging characteristics.

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