EP4S40G2F40I3N

The EP4S40G2F40I3N is a Stratix IV GT FPGA in a 1517-ball FCBGA package, offered in industrial grade. It provides a large programmable fabric and on-chip resources targeted at high-bandwidth, protocol-rich designs that require extensive logic, memory and I/O integration.

Device-family documentation for the Stratix IV series highlights architecture and I/O capabilities such as high-speed transceivers, embedded DSP resources and flexible clocking — enabling designs that demand substantial logic capacity and high aggregate data throughput.

Key Features

• Large FPGA Fabric — 228,000 logic elements to implement complex logic, custom state machines, and protocol stacks.
• Embedded Memory — Approximately 17.5 Mbits of on-chip RAM for buffering, FIFOs and local data storage.
• High I/O Count — 654 user I/O pins to support dense peripheral interfaces and multiple external connections.
• Series Architecture Features — Stratix IV device handbook lists high-speed transceiver features, DSP blocks, PLLs and clock networks as part of the family architecture.
• High-Speed Differential I/O — Family documentation references support for high-speed differential interfaces with features such as DPA and Soft-CDR.
• Package & Mounting — 1517-BBGA (FCBGA) surface-mount package; supplier device package listed as 1517-FBGA (40×40) for high-density board integration.
• Power — Voltage supply range specified at 920 mV to 980 mV for core power planning.
• Industrial Temperature Grade — Rated for operation from 0 °C to 100 °C.
• RoHS Compliant — Meets RoHS environmental requirements.

Typical Applications

• High-speed Communications — Implement multi-protocol interfaces and line-rate packet processing using the family’s high-speed transceiver and large logic capacity.
• Signal Processing & DSP — Use embedded memory and documented DSP block resources for data buffering, filtering and real-time processing tasks.
• Network & Data Center — Combine high I/O count and significant logic elements to build protocol bridges, aggregation and custom switching logic.
• Industrial Automation — Industrial-grade temperature rating and robust packaging support control, motion and I/O aggregation in industrial systems.

Unique Advantages

• High Logic Density: 228,000 logic elements enable implementation of large custom hardware functions without partitioning across multiple parts.
• Substantial On-Chip Memory: Approximately 17.5 Mbits of RAM reduce dependence on external memory for many buffering and storage needs.
• Extensive I/O: 654 I/O pins allow flexible interfacing to a broad range of peripherals and external devices.
• Industrial Qualification: 0 °C to 100 °C operating range and RoHS compliance make the device suitable for industrial deployments.
• High-density Packaging: 1517-ball FCBGA (1517-FBGA, 40×40) supports compact board layouts while maintaining signal routing capacity.
• Family-level High-speed Features: Stratix IV GT family documentation identifies high-speed transceivers, PLLs and advanced I/O features that support protocol and bandwidth-focused designs.

Why Choose EP4S40G2F40I3N?

The EP4S40G2F40I3N positions itself for applications that require a combination of large logic capacity, substantial on-chip memory and a high I/O count in an industrial-grade package. Its Stratix IV GT family attributes—documented support for high-speed transceivers, DSP resources and flexible clocking—align with designs that need high aggregate throughput and protocol versatility.

This device is suited for engineers and procurement teams building high-performance communications, signal-processing or industrial systems where integration density, measurable on-chip resources and a defined industrial temperature range are priorities. The EP4S40G2F40I3N offers a scalable option within the Stratix IV GT family for projects that demand significant programmable logic and embedded resources.

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