EP4S40G2F40I2NAA

IC FPGA 654 I/O 1517FBGA
Part Description

STRATIX® IV GT Field Programmable Gate Array (FPGA) IC 654 17544192 228000 1517-BBGA, FCBGA

Quantity 908 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O654Voltage920 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs91200Number of Logic Elements/Cells228000
Number of GatesN/AECCNOBSOLETEHTS CodeN/A
QualificationN/ATotal RAM Bits17544192

Overview of EP4S40G2F40I2NAA – STRATIX® IV GT FPGA, 228,000 logic elements, 1517-FBGA

The EP4S40G2F40I2NAA is an Intel STRATIX® IV GT field programmable gate array (FPGA) in a 1517-ball FCBGA package designed for industrial applications. Built on the Stratix IV family architecture, this device targets high-bandwidth, compute-intensive designs that require large logic capacity, substantial embedded memory, and extensive I/O connectivity.

With 228,000 logic elements and approximately 17.5 Mbits of embedded memory, the device delivers a balance of programmable logic, on-chip RAM, and system I/O suitable for networking, communications, signal processing, and other performance-driven markets while operating across an industrial temperature range.

Key Features

  • Logic Capacity — 228,000 logic elements to implement complex custom logic, control, and datapath designs.
  • On‑Chip Memory — Approximately 17.5 Mbits of embedded RAM for frame buffering, FIFOs, and LUT-based storage.
  • I/O Density — 654 user I/O pins providing broad external connectivity for high-channel-count applications.
  • High‑Speed Transceiver Support (Family) — Stratix IV GT devices in the family support full-duplex CDR-based transceivers and series-level physical-layer circuitry for common serial protocols and high-speed links.
  • DSP and Arithmetic Blocks (Family) — Family-level high-speed DSP blocks configurable for a range of multiplier widths to accelerate signal-processing tasks.
  • Supply Voltage — Core voltage specified from 920 mV to 980 mV for the device core supply.
  • Package & Mounting — 1517-BBGA / 1517-FBGA (40×40) FCBGA package, surface-mount mounting for compact system integration.
  • Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for industrial environments.
  • Compliance — RoHS-compliant construction.

Typical Applications

  • High‑Performance Networking — Implement packet processing, switching fabric, and protocol offload where dense logic and extensive I/O are required.
  • Telecommunications — Use in line cards and transport equipment leveraging family-level high-speed transceiver and physical-layer features for serial protocols.
  • Video and Broadcast Processing — Frame buffering, transcoding, and real-time signal processing enabled by substantial embedded RAM and DSP resources.
  • Data Center Acceleration — Hardware acceleration and custom datapath implementations that benefit from large logic and memory resources.

Unique Advantages

  • Large Programmable Fabric: 228,000 logic elements provide headroom for complex state machines, datapaths, and control logic, reducing the need for multiple devices.
  • Substantial Embedded Memory: Approximately 17.5 Mbits of on‑chip RAM enables efficient buffering and reduces dependence on external memory for many use cases.
  • High I/O Count: 654 I/Os simplify board-level routing and support multiple parallel interfaces without extensive multiplexing.
  • Industrial Temperature Range: −40 °C to 100 °C rating supports deployment in harsh and temperature-variable environments.
  • Compact, Surface‑Mount Package: 1517-FBGA (40×40) FCBGA package offers a high-density solution for space-constrained designs.
  • RoHS Compliance: Environmentally compliant construction suitable for global manufacturing requirements.

Why Choose EP4S40G2F40I2NAA?

The EP4S40G2F40I2NAA provides a balanced platform of logic density, embedded memory, and high I/O count in a single industrial-grade FPGA package. It is suited to engineers and system architects who need substantial on-chip resources and reliable operation across a wide temperature range. Leveraging the Stratix IV GT family architecture, this device aligns with high-throughput, compute-focused designs that require programmable flexibility and integration.

Choosing this part supports long-term design scalability with a device that integrates core FPGA functionality, ample memory, and industrial-grade specifications to simplify BOM and system design while addressing demanding application requirements.

Request a quote or submit a request for pricing and availability to move your design forward with the EP4S40G2F40I2NAA.

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