EP4S40G2F40I2G

The EP4S40G2F40I2G is an Intel FPGA device aligned with the Stratix IV device family and documented in the Stratix IV Device Handbook. It delivers a high-density programmable fabric with a focus on high aggregate data bandwidth and broad protocol support, making it suitable for communications, signal processing and high-performance embedded designs.

Key hardware characteristics include 228,000 logic elements, approximately 17.5 Mbits of on-chip RAM, 654 user I/O pins, an industrial operating range of –40 °C to 100 °C, and a low core supply range of 0.920–0.980 V. The device is supplied in a 1517-ball FCBGA package for high pin-count, surface-mount implementations.

Key Features

• Core  High-density FPGA fabric with 228,000 logic elements to implement complex custom logic and control functions.
• Embedded Memory  Approximately 17.5 Mbits of on-chip RAM to support large FIFOs, buffers and state storage without external memory.
• I/O and Connectivity  654 user I/Os for wide peripheral interfacing and high-pin-count system integration; Stratix IV family documentation highlights high-speed transceiver and external memory interface support.
• Power and Voltage  Core supply specified from 0.920 V to 0.980 V, enabling low-voltage FPGA operation consistent with modern system power envelopes.
• Package and Mounting  1517-ball FCBGA (1517-BBGA) 40×40 footprint, surface-mount package for compact, high-density PCB layouts.
• Temperature and Grade  Industrial-grade device with an operating temperature range of –40 °C to 100 °C for demanding environmental use.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-bandwidth communications  Leverages the Stratix IV family’s high aggregate data bandwidth and transceiver-oriented architecture for protocol-rich networking and telecom functions.
• Digital signal processing  On-chip logic density and embedded RAM make the device suitable for DSP pipelines, filtering and real-time data manipulation.
• Memory-interface systems  Designed to support external memory interfaces and buffering architectures where large on-chip RAM and many I/Os reduce external component count.
• Industrial control and instrumentation  Industrial temperature grading and plentiful I/O allow robust deployment in factory automation, test equipment and instrument control systems.

Unique Advantages

• High logic density: 228,000 logic elements enable large-scale custom logic integration and multi-function system consolidation.
• Substantial on-chip RAM: Approximately 17.5 Mbits of embedded memory reduces dependence on external memory for buffering and state storage.
• Extensive I/O count: 654 user I/Os support diverse peripherals, parallel interfaces and complex board-level routing.
• Industrial temperature capability: –40 °C to 100 °C rating supports deployments in thermally demanding environments.
• Low-voltage core operation: 0.920–0.980 V core range aligns with modern power-optimized system designs.
• High-density package: 1517-ball FCBGA (40×40) package supports high pin counts in a compact surface-mount form factor.

Why Choose EP4S40G2F40I2G?

The EP4S40G2F40I2G combines a high-capacity programmable fabric with significant embedded memory and a large I/O footprint, positioned for designs that require throughput, flexibility and industrial temperature operation. Its alignment with the Stratix IV device family emphasizes features for high aggregate bandwidth and broad protocol support documented in the device handbook.

This device is well suited to engineers and system designers who need to consolidate functionality into a single FPGA, handle protocol-rich communications or implement compute- and memory-intensive logic while maintaining industrial-grade environmental tolerance and RoHS compliance.

Request a quote or submit an inquiry for pricing and availability for EP4S40G2F40I2G to evaluate this device for your next design.