EP4S40G2F40I1N

The EP4S40G2F40I1N is a STRATIX® IV GT field programmable gate array manufactured by Intel, offering high logic capacity and substantial on-chip memory in a compact FCBGA package. It targets designs that need large programmable logic resources, significant embedded RAM, and a high I/O count.

With 228,000 logic elements, approximately 17.5 Mbits of embedded memory, and 654 I/O, this device is positioned for applications requiring dense digital integration and flexible I/O connectivity while meeting industrial temperature and environmental requirements.

Key Features

• Core capacity – 228,000 logic elements and 9,120 logic blocks provide extensive programmable logic for complex digital designs.
• Embedded memory – Total RAM of 17,544,192 bits (approximately 17.5 Mbits) for on-chip data buffering, state storage, and memory-intensive functions.
• I/O count – 654 I/O pins to support high-pin-count interfaces and parallel connectivity requirements.
• Package – Supplier device package 1517-FBGA (40×40); package case listed as 1517-BBGA, FCBGA; surface-mount mounting type for PCB assembly.
• Power – Core voltage supply range from 920 mV to 980 mV to match system power rails and regulator designs.
• Operating range – Industrial-grade device with an operating temperature range of 0 °C to 100 °C.
• Environmental compliance – RoHS compliant, supporting regulatory and environmental requirements for electronics manufacturing.

Typical Applications

• High-density digital processing – Use the large logic element count and on-chip RAM for complex signal processing, custom datapaths, and parallel compute tasks.
• Communications and networking – Leverage the high I/O count and programmable logic to implement protocol processing, packet handling, and interface bridging.
• Industrial control and automation – Industrial temperature rating and robust I/O support sensor interfacing, motor control logic, and real-time control systems.
• Data acquisition and instrumentation – On-chip memory and abundant logic elements enable buffering, preprocessing, and custom measurement algorithms.

Unique Advantages

• High logic density: 228,000 logic elements allow consolidation of multiple functions into a single device, reducing BOM and board complexity.
• Substantial on-chip memory: Approximately 17.5 Mbits of embedded RAM enables local data buffering and reduces dependence on external memory components.
• Extensive I/O resources: 654 I/O pins simplify integration with peripheral devices, high-speed interfaces, and multi-channel systems.
• Industrial temperature range: Qualified for 0 °C to 100 °C operation, suitable for many industrial environments.
• Compact FCBGA packaging: 1517-FBGA (40×40) package provides a dense footprint for high-pin-count designs while supporting surface-mount assembly.
• RoHS compliant manufacturing: Meets environmental restrictions for lead-free production and end-product compliance.

Why Choose EP4S40G2F40I1N?

The EP4S40G2F40I1N combines a large programmable logic fabric, multi-megabit on-chip RAM, and a generous I/O complement in a compact FCBGA package. These characteristics make it a strong candidate for designs that require consolidation of functions, flexible interfacing, and reliable operation across industrial temperature ranges.

Manufactured by Intel and RoHS compliant, this FPGA offers designers a scalable option for mid- to high-density logic implementations where integration density, embedded memory, and I/O capacity drive system architecture decisions.

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