EP4S100G5H40I3

The EP4S100G5H40I3 is a STRATIX® IV GT FPGA IC delivering high logic density and substantial on-chip memory in a surface-mount FCBGA package. It combines a large logic resource pool with extensive I/O capability and an industrial temperature rating for demanding board-level designs.

Key hardware characteristics include 531,200 logic elements, approximately 28.03 Mbits of embedded RAM, 654 user I/Os, a supply voltage range of 920 mV to 980 mV, and operation across 0 °C to 100 °C. The device is supplied in a 1517-BBGA FCBGA package (supplier package: 1517-HBGA, 42.5 × 42.5 mm) and is RoHS compliant.

Key Features

• Core Logic 531,200 logic elements provide a large programmable fabric for complex digital designs and system integration.
• Embedded Memory Approximately 28.03 Mbits of on-chip RAM enable high-capacity buffering, data storage, and state retention without external memory.
• I/O Capacity 654 user I/Os support extensive external interfacing and parallel connectivity for multi-channel systems.
• Power Operates from a core supply voltage range of 920 mV to 980 mV, allowing designers to plan power delivery and sequencing accordingly.
• Package and Mounting Surface-mount 1517-BBGA FCBGA package (supplier device package: 1517-HBGA, 42.5 × 42.5 mm) suited for dense PCB integration.
• Operating Range Industrial-grade operation from 0 °C to 100 °C for deployment in temperature-variable environments.
• Environmental Compliance RoHS compliant to support regulatory and manufacturing requirements.

Typical Applications

• Networking and Communications — High I/O count and large logic capacity support complex packet processing, protocol handling, and multi-channel interfacing.
• High-Density Digital Processing — Large logic resources and embedded RAM enable FPGA-based acceleration, signal processing, and compute offload tasks.
• Industrial Control and Automation — Industrial temperature rating and robust packaging make the device suitable for control systems, PLCs, and factory automation hardware.
• System Integration and Prototyping — Ample resources and flexible I/O help consolidate multiple functions onto a single FPGA for prototype and production designs.

Unique Advantages

• High Logic Density: 531,200 logic elements allow integration of extensive digital functionality and complex state machines without partitioning across multiple devices.
• Substantial On-Chip Memory: Approximately 28.03 Mbits of embedded RAM reduce dependency on external memory for buffering and intermediate data storage.
• Extensive I/O Count: 654 user I/Os provide flexibility for wide parallel interfaces and multiple peripheral connections.
• Industrial Temperature Rating: Rated for 0 °C to 100 °C operation to meet the needs of many industrial environments.
• Compact, Surface-Mount Package: 1517-BBGA FCBGA packaging (1517-HBGA, 42.5 × 42.5 mm) supports high-density PCB layouts and automated assembly.
• Regulatory Compliance: RoHS compliance supports manufacturing and environmental requirements.

Why Choose EP4S100G5H40I3?

The EP4S100G5H40I3 offers a balance of high logic capacity, significant embedded memory, and a large I/O complement in a manufacturable surface-mount package. Its industrial operating range and RoHS compliance make it a practical choice for engineering teams building complex, board-level digital systems that require consolidated functionality and reliable performance.

This device is well suited for designers and engineers who need to integrate dense logic, substantial on-chip RAM, and broad external interfacing while maintaining adherence to industrial temperature and environmental requirements.

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