EP4S100G5H40I2G
| Part Description |
Field Programmable Gate Array (FPGA) IC |
|---|---|
| Quantity | 586 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-HBGA (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 654 | Voltage | 920 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 11648 | Number of Logic Elements/Cells | 531200 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 28033024 |
Overview of EP4S100G5H40I2G – Field Programmable Gate Array (FPGA) IC
The EP4S100G5H40I2G is an Intel Stratix IV family FPGA offering a high-density programmable fabric for compute- and I/O-intensive embedded designs. This device provides 531,200 logic elements, approximately 28 Mbits of embedded memory, and 654 general-purpose I/O pins to support complex logic, DSP, and high-bandwidth interfacing requirements.
Designed for industrial-grade applications, the device is supplied in a 1517-ball FCBGA package (1517-HBGA, 45×45) with surface-mount mounting, supports an operating voltage range of 920 mV to 980 mV, and an operating temperature range of −40 °C to 100 °C.
Key Features
- Logic Capacity 531,200 logic elements provide substantial programmable fabric for large-scale logic implementation and complex algorithm mapping.
- Embedded Memory Approximately 28 Mbits of on-chip RAM enable wide internal buffering and local storage for high-throughput processing.
- I/O Density 654 I/O pins accommodate extensive external interfacing, enabling multi-channel connectivity and parallel I/O architectures.
- Device Family Architecture Stratix IV device architecture (as documented in the device handbook) includes features for high aggregate data bandwidth, DSP blocks, and a range of protocol support useful for communications and signal-processing tasks.
- Package and Mounting 1517-BBGA (FCBGA) 1517-HBGA (45×45) package in a surface-mount form factor for board-level integration.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C to meet industrial environmental requirements.
- Supply Voltage Operates within a core supply window of 920 mV to 980 mV, enabling predictable power planning for system designs.
- RoHS Compliance RoHS-compliant device suitable for lead-free manufacturing processes.
Typical Applications
- Communications Infrastructure High logic capacity and embedded memory support protocol processing, packet handling, and high-aggregate data bandwidth requirements.
- Signal Processing and DSP On-chip memory and Stratix IV DSP-oriented architecture make the device suitable for multichannel filtering, FFTs, and real-time signal manipulation.
- High-Density I/O Systems Large I/O count enables complex interface aggregation for test equipment, data-acquisition systems, and multi-lane connectivity solutions.
Unique Advantages
- Substantial Logic Resources: 531,200 logic elements allow implementation of large state machines, custom accelerators, and complex control logic on a single device, reducing board-level component count.
- Significant On-Chip Memory: Approximately 28 Mbits of embedded RAM reduce reliance on external memory for buffering and low-latency data paths.
- High I/O Count: 654 I/O pins provide flexibility for parallel interfaces, multi-channel aggregation, and extensive sensor or peripheral connectivity.
- Industrial Temperature Rating: Qualified for −40 °C to 100 °C operation to support deployment in industrial environments.
- Integrated Stratix IV Capabilities: Device architecture documented in the Stratix IV device handbook includes features for DSP, high-speed transceivers, and wide protocol support that streamline development for data- and signal-intensive designs.
- Manufacturing Compliance: RoHS compliance supports lead-free assembly and regulatory requirements for modern production lines.
Why Choose EP4S100G5H40I2G?
The EP4S100G5H40I2G positions itself as a high-density Stratix IV FPGA option for projects that require large programmable logic resources, significant on-chip memory, and extensive I/O in an industrial-rated package. Its combination of logic capacity, embedded RAM, and I/O density makes it well suited for designers building communications equipment, advanced signal-processing systems, and high-channel-count interface solutions.
With RoHS compliance and a defined operating voltage and temperature range, the device supports predictable system design and manufacturing. Customers targeting scalable, robust FPGA-based implementations can leverage the documented Stratix IV architecture and on-chip resources to simplify board-level design and shorten development cycles.
Request a quote or submit a pricing inquiry today to evaluate EP4S100G5H40I2G for your next high-density FPGA design.

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