EP4S100G5H40I2G

IC FPGA 654 I/O 1517HBGA
Part Description

Field Programmable Gate Array (FPGA) IC

Quantity 586 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1517-HBGA (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O654Voltage920 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11648Number of Logic Elements/Cells531200
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits28033024

Overview of EP4S100G5H40I2G – Field Programmable Gate Array (FPGA) IC

The EP4S100G5H40I2G is an Intel Stratix IV family FPGA offering a high-density programmable fabric for compute- and I/O-intensive embedded designs. This device provides 531,200 logic elements, approximately 28 Mbits of embedded memory, and 654 general-purpose I/O pins to support complex logic, DSP, and high-bandwidth interfacing requirements.

Designed for industrial-grade applications, the device is supplied in a 1517-ball FCBGA package (1517-HBGA, 45×45) with surface-mount mounting, supports an operating voltage range of 920 mV to 980 mV, and an operating temperature range of −40 °C to 100 °C.

Key Features

  • Logic Capacity  531,200 logic elements provide substantial programmable fabric for large-scale logic implementation and complex algorithm mapping.
  • Embedded Memory  Approximately 28 Mbits of on-chip RAM enable wide internal buffering and local storage for high-throughput processing.
  • I/O Density  654 I/O pins accommodate extensive external interfacing, enabling multi-channel connectivity and parallel I/O architectures.
  • Device Family Architecture  Stratix IV device architecture (as documented in the device handbook) includes features for high aggregate data bandwidth, DSP blocks, and a range of protocol support useful for communications and signal-processing tasks.
  • Package and Mounting  1517-BBGA (FCBGA) 1517-HBGA (45×45) package in a surface-mount form factor for board-level integration.
  • Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet industrial environmental requirements.
  • Supply Voltage  Operates within a core supply window of 920 mV to 980 mV, enabling predictable power planning for system designs.
  • RoHS Compliance  RoHS-compliant device suitable for lead-free manufacturing processes.

Typical Applications

  • Communications Infrastructure  High logic capacity and embedded memory support protocol processing, packet handling, and high-aggregate data bandwidth requirements.
  • Signal Processing and DSP  On-chip memory and Stratix IV DSP-oriented architecture make the device suitable for multichannel filtering, FFTs, and real-time signal manipulation.
  • High-Density I/O Systems  Large I/O count enables complex interface aggregation for test equipment, data-acquisition systems, and multi-lane connectivity solutions.

Unique Advantages

  • Substantial Logic Resources: 531,200 logic elements allow implementation of large state machines, custom accelerators, and complex control logic on a single device, reducing board-level component count.
  • Significant On-Chip Memory: Approximately 28 Mbits of embedded RAM reduce reliance on external memory for buffering and low-latency data paths.
  • High I/O Count: 654 I/O pins provide flexibility for parallel interfaces, multi-channel aggregation, and extensive sensor or peripheral connectivity.
  • Industrial Temperature Rating: Qualified for −40 °C to 100 °C operation to support deployment in industrial environments.
  • Integrated Stratix IV Capabilities: Device architecture documented in the Stratix IV device handbook includes features for DSP, high-speed transceivers, and wide protocol support that streamline development for data- and signal-intensive designs.
  • Manufacturing Compliance: RoHS compliance supports lead-free assembly and regulatory requirements for modern production lines.

Why Choose EP4S100G5H40I2G?

The EP4S100G5H40I2G positions itself as a high-density Stratix IV FPGA option for projects that require large programmable logic resources, significant on-chip memory, and extensive I/O in an industrial-rated package. Its combination of logic capacity, embedded RAM, and I/O density makes it well suited for designers building communications equipment, advanced signal-processing systems, and high-channel-count interface solutions.

With RoHS compliance and a defined operating voltage and temperature range, the device supports predictable system design and manufacturing. Customers targeting scalable, robust FPGA-based implementations can leverage the documented Stratix IV architecture and on-chip resources to simplify board-level design and shorten development cycles.

Request a quote or submit a pricing inquiry today to evaluate EP4S100G5H40I2G for your next high-density FPGA design.

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