EP4S100G5H40I3N

The EP4S100G5H40I3N is a STRATIX® IV GT FPGA from Intel offering a high-capacity programmable logic fabric. It delivers 531,200 logic elements and approximately 28 Mbits of embedded memory to support complex, high-density designs.

Designed for industrial applications, this surface-mount device provides 654 I/O, a 1517-BBGA (FCBGA) package with a supplier device package dimension of 42.5×42.5 mm, a core voltage supply range of 920 mV to 980 mV, and an operating temperature range of 0 °C to 100 °C. The device is RoHS compliant.

Key Features

• Logic Capacity  531,200 logic elements provide extensive programmable resources for large-scale digital designs.
• Embedded Memory  Approximately 28 Mbits of on-chip RAM for buffering, state storage and local data handling.
• I/O Density  654 general-purpose I/O pins to support wide connectivity and multiple parallel interfaces.
• Package & Mounting  1517-BBGA (FCBGA) package; supplier device package 1517-HBGA (42.5×42.5 mm); surface-mount mounting type for board-level integration.
• Power  Core voltage supply range from 920 mV to 980 mV to match system power domains.
• Operating Range & Grade  Industrial grade with an operating temperature range of 0 °C to 100 °C for deployment in controlled industrial environments.
• Environmental Compliance  RoHS compliant for reduced hazardous substance content.

Typical Applications

• Industrial Control  Use the large logic fabric and abundant I/O to implement programmable controllers, automation logic, and real-time control functions within industrial temperature envelopes.
• Data Acquisition & Signal Processing  Leverage the embedded memory and high logic density for on-chip buffering, preprocessing, and custom signal-processing pipelines.
• Communications & Protocol Bridging  High I/O count and substantial logic resources enable protocol conversion, interface aggregation, and custom packet handling in communication equipment.

Unique Advantages

• High logic density: 531,200 logic elements accommodate large, complex designs without immediate migration to multi-device solutions.
• On-chip memory capacity: Approximately 28 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage tasks.
• Extensive connectivity: 654 I/O pins provide flexibility for parallel interfaces, multiple peripherals, and dense board-level interconnects.
• Industrial-grade specification: Rated for 0 °C to 100 °C operation and marked as industrial grade for use in controlled industrial environments.
• Compact BGA packaging: 1517-BBGA / 1517-HBGA (42.5×42.5 mm) delivers high pin count in a compact surface-mount form factor suited to space-constrained boards.
• Regulatory compliance: RoHS compliance supports environmental and materials requirements.

Why Choose EP4S100G5H40I3N?

The EP4S100G5H40I3N positions itself as a high-capacity, industrial-grade FPGA option for designs that demand significant on-chip logic, embedded memory, and extensive I/O. Its combination of 531,200 logic elements, approximately 28 Mbits of RAM, and 654 I/O pins makes it suitable for consolidating complex functions into a single programmable device.

With a surface-mount BGA package and a core supply window of 920 mV to 980 mV, this device supports integration into robust industrial systems operating between 0 °C and 100 °C while meeting RoHS requirements—providing a scalable building block for engineers targeting high-density, industrial FPGA applications.

Request a quote or submit a purchase inquiry for EP4S100G5H40I3N to discuss availability and pricing for your next design.