EP4S100G5H40I1
| Part Description |
STRATIX® IV GT Field Programmable Gate Array (FPGA) IC 654 28033024 531200 1517-BBGA, FCBGA |
|---|---|
| Quantity | 1,311 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-HBGA (42.5x42.5) | Grade | Industrial | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 654 | Voltage | 920 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 21248 | Number of Logic Elements/Cells | 531200 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 28033024 |
Overview of EP4S100G5H40I1 – STRATIX® IV GT Field Programmable Gate Array (FPGA) IC 654 28033024 531200 1517-BBGA, FCBGA
The EP4S100G5H40I1 is a STRATIX® IV GT Field Programmable Gate Array (FPGA) from Intel, providing a large logic fabric and substantial on-chip memory for complex digital designs. With 531,200 logic elements and approximately 28 Mbits of embedded memory, this device targets high-density programmable logic applications where integration of logic, memory, and high pin-count I/O is required.
Packaged in a 1517-BBGA FCBGA with a 42.5 × 42.5 mm supplier package option and specified for industrial-grade operation (0 °C to 100 °C), the EP4S100G5H40I1 is suited to designs that require significant gate density, many I/O signals, and compact board-level mounting.
Key Features
- Logic Capacity — Provides 531,200 logic elements to implement complex custom digital functions and large-scale state machines.
- Configurable Logic Blocks — Reported 21,248 configurable logic blocks (CLBs) for organizing logic and design partitioning.
- Embedded Memory — Approximately 28 Mbits of on-chip RAM to support buffering, lookup tables, and data processing close to logic resources.
- I/O Density — Up to 654 I/O pins for high connectivity to peripherals, sensors, and external devices.
- Power Supply — Core voltage range specified at 920 mV to 980 mV for the device core power domain.
- Package & Mounting — 1517-BBGA FCBGA package, supplier package 1517-HBGA (42.5 × 42.5 mm), surface-mount mounting for compact board integration.
- Industrial Temperature Grade — Rated for operation from 0 °C to 100 °C, suitable for industrial environment temperature ranges.
- Manufacturer — Produced by Intel, a widely recognized FPGA supplier.
- RoHS Compliant — Meets RoHS environmental compliance requirements.
Typical Applications
- Industrial Control Systems — Use the device’s large logic capacity and extensive I/O to implement control logic, signal conditioning, and custom automation functions.
- High-Density Prototyping — Ideal for complex prototype implementations that require abundant logic elements and embedded memory to validate large designs.
- Data Aggregation and Pre-Processing — On-chip RAM and abundant logic resources enable buffering, packet sorting, and pre-processing tasks before further system processing.
- Interface Bridging — High I/O count supports bridging between multiple peripherals and subsystems, consolidating interface logic into a single device.
Unique Advantages
- Substantial Logic Density: 531,200 logic elements provide headroom for large-scale custom logic and algorithm implementation without immediate need for multiple devices.
- Significant On-Chip Memory: Approximately 28 Mbits of embedded RAM reduces external memory dependencies and lowers system-level latency.
- High I/O Count: Up to 654 I/O pins enable direct connections to numerous peripherals, sensors, and external interfaces, simplifying board-level routing.
- Industrial Temperature Range: Rated 0 °C to 100 °C to meet many industrial deployment requirements where extended ambient temperature operation is needed.
- Compact FCBGA Package: 1517-BBGA package and 42.5 × 42.5 mm supplier footprint provide a high-density solution for space-constrained designs.
- Controlled Core Voltage Range: Specified core voltage of 920–980 mV supports predictable power domain design and supply planning.
Why Choose EP4S100G5H40I1?
The EP4S100G5H40I1 positions itself as a high-capacity STRATIX® IV GT FPGA option for engineers who need abundant logic resources, large embedded memory, and a high I/O count in a compact FCBGA package. Its industrial-grade operating range and defined core voltage window make it suitable for robust board-level integration in industrial and complex prototyping environments.
Designed and manufactured by Intel, this device is appropriate for teams implementing large custom digital functions, consolidating multiple interfaces, or reducing external memory and component count through on-chip resources. Its combination of logic density, embedded RAM, and I/O flexibility offers long-term value for scalable, high-density FPGA designs.
Request a quote or submit an inquiry to receive pricing and availability for EP4S100G5H40I1 and to discuss how this FPGA can meet your design requirements.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018