EP4S100G5F45I3N

The EP4S100G5F45I3N is a STRATIX® IV GT field programmable gate array (FPGA) supplied in a 1932-ball FCBGA package. It provides high on-chip logic and memory capacity along with a large number of user I/O for designs that require dense integration of digital logic and embedded memory.

Key architectural characteristics include 531,200 logic elements, approximately 28 Mbits of embedded RAM, and 781 user I/O pins. The device is rated for industrial operation and supports surface-mount PCB assembly.

Key Features

• Core Capacity — 531,200 logic elements and 21,248 LABs deliver high logic density for complex digital designs.
• Embedded Memory — Approximately 28 Mbits of on-chip RAM for buffering, lookup tables, and local storage.
• High I/O Count — 781 user I/O pins to accommodate extensive external interfaces and parallel data paths.
• Power Requirements — Core voltage supply range from 920 mV to 980 mV to guide power-supply design and sequencing.
• Industrial Temperature Grade — Rated for operation from 0 °C to 100 °C for industrial-temperature environments.
• Package & Mounting — 1932-BBGA (supplier package: 1932-FBGA, FC (45×45)) in a surface-mount FCBGA format for high-density PCB integration.
• Regulatory — RoHS compliant.

Unique Advantages

• High logic density: 531,200 logic elements support large, complex designs without immediate need for multi-device partitioning.
• Substantial embedded memory: Approximately 28 Mbits of on-chip RAM reduces external memory dependency for many buffering and state-storage needs.
• Extensive I/O capability: 781 user I/O pins enable broad connectivity options and high parallelism for data paths and interfaces.
• Industrial-grade operation: Specified 0 °C to 100 °C operating range aligns the device to industrial applications requiring wider temperature tolerance.
• Compact FCBGA packaging: 1932-ball FCBGA (45×45) in a surface-mount form factor facilitates high I/O density while maintaining a manageable PCB footprint.
• RoHS compliance: Meets environmental regulatory requirements for lead-free assembly and component selection.

Why Choose EP4S100G5F45I3N?

The EP4S100G5F45I3N positions itself as a high-capacity FPGA option for designs that require a combination of large logic resources, significant embedded memory, and a very high count of user I/O. Its industrial temperature rating and surface-mount FCBGA package make it suitable for demanding, space-constrained applications where on-chip integration and robust thermal margins are important.

Choosing this device offers designers a single-chip approach to consolidate logic and memory needs while simplifying board-level routing for high-density I/O. The documented voltage range and RoHS compliance provide clear design constraints for power and regulatory planning.

Request a quote or submit a purchase inquiry for EP4S100G5F45I3N to begin the procurement process and confirm availability and pricing.