EP4S100G5F45I3G
| Part Description |
Field Programmable Gate Array (FPGA) IC |
|---|---|
| Quantity | 1,456 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 781 | Voltage | 920 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 11648 | Number of Logic Elements/Cells | 531200 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 28033024 |
Overview of EP4S100G5F45I3G – Field Programmable Gate Array (FPGA) IC
The EP4S100G5F45I3G is an Intel FPGA device from the Stratix IV family designed for high-density digital logic and system integration. It provides a large programmable fabric together with architecture-level features such as high-speed transceivers, DSP blocks, and rich I/O capabilities for demanding embedded and communications applications.
With 531,200 logic elements, approximately 28 Mbits of embedded memory and 781 user I/Os, this industrial‑grade, surface‑mount FCBGA device targets designs that require significant logic capacity, high I/O density, and extended temperature operation.
Key Features
- Core logic 531,200 logic elements providing substantial programmable fabric for complex logic, state machines, and custom accelerators.
- Logic array blocks Organized across 11,648 logic array blocks (LABs) to structure and distribute logic resources.
- Embedded memory Approximately 28 Mbits of on‑chip RAM to support buffering, LUTs, and local storage for DSP and data‑flow tasks.
- High‑speed architecture features Stratix IV family architectures include high‑speed transceiver capability, DSP blocks, PLLs, and dedicated clock networks to support high aggregate bandwidth and protocol handling.
- I/O density 781 user I/Os enable wide external connectivity and complex board‑level interfacing.
- Power / core supply Core voltage operation specified from 920 mV to 980 mV for compatible low‑voltage power domains.
- Package and mounting Available in a 1932‑ball FCBGA / BBGA format (supplier device package: 1932‑FBGA, FC 45×45) optimized for surface‑mount assembly.
- Temperature and grade Industrial grade with operating range of −40 °C to 100 °C for extended temperature applications.
- Standards and compliance RoHS compliant material and manufacturing status.
Typical Applications
- Communications & Networking High‑speed transceiver features and large I/O count support protocol handling, data aggregation and packet processing tasks.
- High‑performance Signal Processing Dense logic resources, DSP blocks and approximately 28 Mbits of embedded memory enable filters, transforms and custom accelerators.
- External Memory Interface Designs Device architecture supports external memory interfaces for systems that require large off‑chip storage and high throughput.
- Industrial Control & Automation Industrial grade temperature range and robust packaging make the device suitable for extended‑temperature control, sensor aggregation and automation systems.
Unique Advantages
- High programmable capacity: 531,200 logic elements deliver the scale needed for complex SoC emulation, multi‑channel processing and custom IP integration.
- Substantial embedded memory: Approximately 28 Mbits of on‑chip RAM reduces dependence on external RAM for many buffering and local‑storage tasks.
- Extensive I/O resources: 781 user I/Os allow dense board‑level connectivity and flexible interfacing with peripherals and high‑speed links.
- Architecture-level performance blocks: Stratix IV features such as DSP blocks, PLLs and dedicated clock networks support deterministic timing and high aggregate bandwidth.
- Industrial robustness: Specified operating range of −40 °C to 100 °C and surface‑mount FCBGA packaging support deployment in industrial environments.
- Low‑voltage core operation: Core supply range of 920 mV to 980 mV aligns with modern low‑voltage power systems.
Why Choose EP4S100G5F45I3G?
The EP4S100G5F45I3G combines a high‑density programmable fabric with Stratix IV architectural features to address designs requiring significant logic, memory and I/O resources. Its industrial grade specification and surface‑mount FCBGA packaging make it suitable for demanding embedded, communications and industrial applications where extended temperature operation and high integration are required.
Engineers building bandwidth‑intensive systems, complex signal processing pipelines or multi‑interface controllers will find the device’s mix of logic elements, embedded memory and architecture‑level peripherals well suited to reducing board complexity and concentrating functionality within a single FPGA device.
Request a quote or submit an inquiry today for pricing and availability of EP4S100G5F45I3G.

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