EP4S100G5F45I2G
| Part Description |
Field Programmable Gate Array (FPGA) IC |
|---|---|
| Quantity | 70 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 781 | Voltage | 920 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 11648 | Number of Logic Elements/Cells | 531200 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 28033024 |
Overview of EP4S100G5F45I2G – Field Programmable Gate Array (FPGA) IC
The EP4S100G5F45I2G is a Field Programmable Gate Array (FPGA) IC from Intel, built on the Stratix IV device family architecture. It combines high logic capacity, substantial embedded memory, and extensive I/O to support complex digital designs and high-bandwidth system integration.
Targeted at industrial applications, this device is specified for a wide operating temperature range and RoHS compliance, delivering a platform for designs that require large-scale logic integration, advanced I/O capability, and Stratix IV architectural features such as high-speed transceivers, DSP blocks, and flexible clocking.
Key Features
- Stratix IV Architecture Includes architecture-level features noted in the Stratix IV device handbook: high-speed transceiver capabilities, DSP blocks, PLLs, clock networks, and external memory interface support.
- Logic Capacity Approximately 531,200 logic elements to implement large and complex FPGA designs.
- Embedded Memory Approximately 28 Mbits of embedded memory (28,033,024 total RAM bits) for buffering, state storage, and on-chip data handling.
- High I/O Count 781 I/O pins provide broad connectivity for external peripherals, memory devices, and high-density system interfaces.
- High-Speed I/O Features Device documentation highlights high-speed differential I/O support with features such as DPA and Soft-CDR for reliable serial data interfaces.
- Package & Mounting Available in a 1932-ball FCBGA package (1932-FBGA, 45×45), designed for surface-mount PCB assembly.
- Supply Voltage Operates with a core voltage supply range of 920 mV to 980 mV.
- Industrial Grade & Temperature Range Specified for industrial operation with an operating temperature range of −40 °C to 100 °C and RoHS compliance.
Typical Applications
- High-Bandwidth Communications Implements protocol and link-layer logic where high aggregate data bandwidth and high-speed transceivers are required.
- Signal Processing & DSP Leverages embedded memory and Stratix IV DSP blocks for data-intensive signal processing tasks and algorithm acceleration.
- Memory Interface Controllers Supports designs requiring robust external memory interfaces and on-chip buffering for storage and caching applications.
- Industrial Control & Embedded Systems Provides a high-density logic platform with wide operating temperatures suitable for industrial embedded control and automation systems.
Unique Advantages
- High Logic Density: Approximately 531,200 logic elements enable consolidation of complex system functions into a single device, reducing board-level component count.
- Substantial On‑Chip Memory: Approximately 28 Mbits of embedded RAM supports large buffers, FIFOs, and state machines without immediate need for external memory.
- Extensive External Connectivity: 781 I/O pins allow flexible partitioning between interfaces, sensors, memory devices, and high-speed links.
- Industrial Reliability: Specified for −40 °C to 100 °C operation and RoHS compliance for deployments in industrial environments.
- Stratix IV Feature Set: Built on an architecture documented for high-speed transceivers, DSP blocks, PLLs, and flexible clocking—facilitating integration of complex, high-performance subsystems.
- Compact Surface-Mount Packaging: 1932-FBGA (45×45) package supports high-density PCB layouts and production surface-mount assembly.
Why Choose EP4S100G5F45I2G?
The EP4S100G5F45I2G positions itself as a high-capacity Stratix IV FPGA option for designers who need substantial logic resources, significant on-chip memory, and a large I/O complement within an industrial-grade device. Its documented Stratix IV features—high-speed transceivers, DSP capabilities, and flexible clocking—support demanding data-path and system-integration tasks.
This part is suited for engineering teams building high-bandwidth communications gear, advanced signal-processing modules, memory-interface controllers, and industrial embedded systems where logic density, I/O count, and operating range are key selection criteria. The combination of these specifications and Intel’s device documentation supports long-term design planning and deployment.
Request a quote or submit a sales inquiry to get pricing and availability information for EP4S100G5F45I2G.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018