EP4S100G5F45I2G

IC FPGA 781 I/O 1932FCBGA
Part Description

Field Programmable Gate Array (FPGA) IC

Quantity 70 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O781Voltage920 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11648Number of Logic Elements/Cells531200
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits28033024

Overview of EP4S100G5F45I2G – Field Programmable Gate Array (FPGA) IC

The EP4S100G5F45I2G is a Field Programmable Gate Array (FPGA) IC from Intel, built on the Stratix IV device family architecture. It combines high logic capacity, substantial embedded memory, and extensive I/O to support complex digital designs and high-bandwidth system integration.

Targeted at industrial applications, this device is specified for a wide operating temperature range and RoHS compliance, delivering a platform for designs that require large-scale logic integration, advanced I/O capability, and Stratix IV architectural features such as high-speed transceivers, DSP blocks, and flexible clocking.

Key Features

  • Stratix IV Architecture  Includes architecture-level features noted in the Stratix IV device handbook: high-speed transceiver capabilities, DSP blocks, PLLs, clock networks, and external memory interface support.
  • Logic Capacity  Approximately 531,200 logic elements to implement large and complex FPGA designs.
  • Embedded Memory  Approximately 28 Mbits of embedded memory (28,033,024 total RAM bits) for buffering, state storage, and on-chip data handling.
  • High I/O Count  781 I/O pins provide broad connectivity for external peripherals, memory devices, and high-density system interfaces.
  • High-Speed I/O Features  Device documentation highlights high-speed differential I/O support with features such as DPA and Soft-CDR for reliable serial data interfaces.
  • Package & Mounting  Available in a 1932-ball FCBGA package (1932-FBGA, 45×45), designed for surface-mount PCB assembly.
  • Supply Voltage  Operates with a core voltage supply range of 920 mV to 980 mV.
  • Industrial Grade & Temperature Range  Specified for industrial operation with an operating temperature range of −40 °C to 100 °C and RoHS compliance.

Typical Applications

  • High-Bandwidth Communications  Implements protocol and link-layer logic where high aggregate data bandwidth and high-speed transceivers are required.
  • Signal Processing & DSP  Leverages embedded memory and Stratix IV DSP blocks for data-intensive signal processing tasks and algorithm acceleration.
  • Memory Interface Controllers  Supports designs requiring robust external memory interfaces and on-chip buffering for storage and caching applications.
  • Industrial Control & Embedded Systems  Provides a high-density logic platform with wide operating temperatures suitable for industrial embedded control and automation systems.

Unique Advantages

  • High Logic Density: Approximately 531,200 logic elements enable consolidation of complex system functions into a single device, reducing board-level component count.
  • Substantial On‑Chip Memory: Approximately 28 Mbits of embedded RAM supports large buffers, FIFOs, and state machines without immediate need for external memory.
  • Extensive External Connectivity: 781 I/O pins allow flexible partitioning between interfaces, sensors, memory devices, and high-speed links.
  • Industrial Reliability: Specified for −40 °C to 100 °C operation and RoHS compliance for deployments in industrial environments.
  • Stratix IV Feature Set: Built on an architecture documented for high-speed transceivers, DSP blocks, PLLs, and flexible clocking—facilitating integration of complex, high-performance subsystems.
  • Compact Surface-Mount Packaging: 1932-FBGA (45×45) package supports high-density PCB layouts and production surface-mount assembly.

Why Choose EP4S100G5F45I2G?

The EP4S100G5F45I2G positions itself as a high-capacity Stratix IV FPGA option for designers who need substantial logic resources, significant on-chip memory, and a large I/O complement within an industrial-grade device. Its documented Stratix IV features—high-speed transceivers, DSP capabilities, and flexible clocking—support demanding data-path and system-integration tasks.

This part is suited for engineering teams building high-bandwidth communications gear, advanced signal-processing modules, memory-interface controllers, and industrial embedded systems where logic density, I/O count, and operating range are key selection criteria. The combination of these specifications and Intel’s device documentation supports long-term design planning and deployment.

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