EP4S100G5F45I1N

The EP4S100G5F45I1N is a STRATIX® IV GT Field Programmable Gate Array (FPGA) in a 1932-BBGA FCBGA package from Intel. It delivers high logic capacity and extensive I/O in a surface-mount FPGA designed for industrial-temperature operation.

With 531,200 logic elements, approximately 28.0 Mbits of embedded memory, and 781 I/O pins, this device targets designs that require dense programmable logic, significant on-chip RAM, and large I/O connectivity while operating within a 0 °C to 100 °C range.

Key Features

• Core Logic 531,200 logic elements provide substantial programmable capacity for complex digital designs.
• Embedded Memory Approximately 28.0 Mbits of on-chip RAM to support buffering, packet processing, and other memory-intensive functions.
• High I/O Count 781 available I/O pins enable broad external connectivity and parallel interfacing options.
• Power Supply Core voltage specified from 920 mV to 980 mV to match system power rail design requirements.
• Package and Mounting 1932-BBGA FCBGA package (supplier device package: 1932-FBGA, FC 45×45) in a surface-mount form factor for compact board integration.
• Operating Temperature Industrial operating range from 0 °C to 100 °C to support deployment in temperature-demanding environments.
• Regulatory RoHS compliant.

Typical Applications

• High-density digital systems — Implement large-scale logic functions that leverage 531,200 logic elements for complex signal processing or protocol handling.
• Memory-intensive designs — Use the approximately 28.0 Mbits of embedded RAM for buffering, queueing, and on-chip data storage.
• High‑I/O interfaces — Deploy the 781 I/Os for multi-lane interfaces, parallel sensor arrays, or dense peripheral connectivity.

Unique Advantages

• Substantial programmable capacity — 531,200 logic elements enable implementation of large, integrated digital subsystems on a single device.
• On-chip memory for reduced external RAM dependence — Approximately 28.0 Mbits of embedded RAM supports data buffering and reduces immediate reliance on external memory components.
• Extensive external connectivity — 781 I/O pins facilitate complex board-level interfacing without multiplexing compromise.
• Compact, industry-ready packaging — 1932-BBGA FCBGA surface-mount package (45×45) allows dense PCB layouts while supporting industrial-temperature operation.
• Low-voltage core compatibility — Core supply range of 920 mV to 980 mV fits modern low-voltage system power domains.
• RoHS compliance — Conforms to lead-free manufacturing and environmental requirements.

Why Choose EP4S100G5F45I1N?

The EP4S100G5F45I1N combines high logic density, substantial on-chip RAM, and a very large I/O complement in a compact 1932-BBGA FCBGA package. Its specified core voltage range and 0 °C to 100 °C operating window make it suitable for industrial applications and systems that demand dense, integrated programmable logic.

This FPGA is a practical choice for engineers and procurement teams specifying devices for designs that require scalable logic resources, significant embedded memory bandwidth, and broad external connectivity while maintaining a compact board footprint.

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