EP4S100G5F45I1

IC FPGA 781 I/O 1932FBGA
Part Description

STRATIX® IV GT Field Programmable Gate Array (FPGA) IC 781 28033024 531200 1932-BBGA, FCBGA

Quantity 390 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeIndustrialOperating Temperature0°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O781Voltage920 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs21248Number of Logic Elements/Cells531200
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits28033024

Overview of EP4S100G5F45I1 – STRATIX® IV GT Field Programmable Gate Array (FPGA) IC

The EP4S100G5F45I1 is a STRATIX® IV GT Field Programmable Gate Array providing substantial on-chip logic and memory in a high-pin-count BGA package. It delivers 531,200 logic elements and approximately 28 Mbits of embedded memory, combined with up to 781 I/O pins, making it suitable for complex programmable-logic designs that require large logic capacity and extensive I/O integration.

Packaged as a 1932-ball FCBGA (45×45 mm supplier package) and rated for industrial use, the device targets system designs requiring surface-mount integration, mid-range operating voltage, and an operating temperature range from 0 °C to 100 °C.

Key Features

  • Core Logic Capacity — 531,200 logic elements provide a large programmable fabric for implementing complex digital functions and high-density logic blocks.
  • Embedded Memory — Approximately 28 Mbits of on-chip RAM support data buffering, FIFOs, and memory-intensive logic without external memory for many use cases.
  • I/O Density — Up to 781 I/O pins enable broad peripheral and interface connectivity for high-bandwidth system integration.
  • Package and Mounting — 1932-BBGA, FCBGA package with surface-mount mounting suitable for compact, board-level integration; supplier device package noted as 1932-FBGA, FC (45×45).
  • Power — Operates from a core supply range of 920 mV to 980 mV, allowing designers to plan power delivery and sequencing around a defined core voltage window.
  • Industrial Grade and Thermal — Industrial-grade device rated for operation from 0 °C to 100 °C, enabling deployment in a range of industrial environments.
  • RoHS Compliance — RoHS-compliant material status supports regulatory requirements for lead-free assemblies.

Typical Applications

  • High-density digital processing — Implement large-scale logic functions, custom datapaths, and protocol processing using the device's substantial logic and memory resources.
  • Interface aggregation and bridging — Leverage up to 781 I/O pins to consolidate multiple peripherals, buses, or custom interfaces on a single FPGA-based bridge.
  • Embedded system control — Use the integrated memory and logic to implement control, sequencing, and state machines for industrial systems operating within the specified temperature range.

Unique Advantages

  • Large programmable capacity: 531,200 logic elements enable implementation of complex designs without immediate recourse to external logic expansion.
  • Significant on-chip memory: Approximately 28 Mbits of embedded RAM reduces dependency on external memory for many buffering and storage functions.
  • Extensive connectivity: Up to 781 I/O pins provide flexibility for dense interconnect, simplifying board-level routing for multi-interface systems.
  • Industrial operating range: Rated 0 °C to 100 °C for reliable operation in industrial-temperature environments.
  • Compact, high-density package: 1932-ball FCBGA package supports high-pin-count integration in a compact footprint for space-constrained designs.
  • Regulatory-friendly materials: RoHS compliance helps streamline product compliance for lead-free assembly requirements.

Why Choose EP4S100G5F45I1?

The EP4S100G5F45I1 combines a high logic-element count, substantial embedded memory, and extensive I/O in an industrial-grade FCBGA package, offering a balanced platform for demanding programmable-logic applications. Its defined core voltage window and surface-mount package support practical system-level power and mechanical integration.

This device is well suited to engineering teams developing complex digital systems that require scalable logic capacity, significant on-chip memory, and large I/O counts within an industrial temperature envelope—providing a clear hardware foundation for mid- to high-density FPGA designs.

Request a quote or submit a product inquiry to receive pricing, availability, and ordering information for the EP4S100G5F45I1 STRATIX® IV GT FPGA.

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