EP4S100G5F45I1
| Part Description |
STRATIX® IV GT Field Programmable Gate Array (FPGA) IC 781 28033024 531200 1932-BBGA, FCBGA |
|---|---|
| Quantity | 390 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Industrial | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 781 | Voltage | 920 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 21248 | Number of Logic Elements/Cells | 531200 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 28033024 |
Overview of EP4S100G5F45I1 – STRATIX® IV GT Field Programmable Gate Array (FPGA) IC
The EP4S100G5F45I1 is a STRATIX® IV GT Field Programmable Gate Array providing substantial on-chip logic and memory in a high-pin-count BGA package. It delivers 531,200 logic elements and approximately 28 Mbits of embedded memory, combined with up to 781 I/O pins, making it suitable for complex programmable-logic designs that require large logic capacity and extensive I/O integration.
Packaged as a 1932-ball FCBGA (45×45 mm supplier package) and rated for industrial use, the device targets system designs requiring surface-mount integration, mid-range operating voltage, and an operating temperature range from 0 °C to 100 °C.
Key Features
- Core Logic Capacity — 531,200 logic elements provide a large programmable fabric for implementing complex digital functions and high-density logic blocks.
- Embedded Memory — Approximately 28 Mbits of on-chip RAM support data buffering, FIFOs, and memory-intensive logic without external memory for many use cases.
- I/O Density — Up to 781 I/O pins enable broad peripheral and interface connectivity for high-bandwidth system integration.
- Package and Mounting — 1932-BBGA, FCBGA package with surface-mount mounting suitable for compact, board-level integration; supplier device package noted as 1932-FBGA, FC (45×45).
- Power — Operates from a core supply range of 920 mV to 980 mV, allowing designers to plan power delivery and sequencing around a defined core voltage window.
- Industrial Grade and Thermal — Industrial-grade device rated for operation from 0 °C to 100 °C, enabling deployment in a range of industrial environments.
- RoHS Compliance — RoHS-compliant material status supports regulatory requirements for lead-free assemblies.
Typical Applications
- High-density digital processing — Implement large-scale logic functions, custom datapaths, and protocol processing using the device's substantial logic and memory resources.
- Interface aggregation and bridging — Leverage up to 781 I/O pins to consolidate multiple peripherals, buses, or custom interfaces on a single FPGA-based bridge.
- Embedded system control — Use the integrated memory and logic to implement control, sequencing, and state machines for industrial systems operating within the specified temperature range.
Unique Advantages
- Large programmable capacity: 531,200 logic elements enable implementation of complex designs without immediate recourse to external logic expansion.
- Significant on-chip memory: Approximately 28 Mbits of embedded RAM reduces dependency on external memory for many buffering and storage functions.
- Extensive connectivity: Up to 781 I/O pins provide flexibility for dense interconnect, simplifying board-level routing for multi-interface systems.
- Industrial operating range: Rated 0 °C to 100 °C for reliable operation in industrial-temperature environments.
- Compact, high-density package: 1932-ball FCBGA package supports high-pin-count integration in a compact footprint for space-constrained designs.
- Regulatory-friendly materials: RoHS compliance helps streamline product compliance for lead-free assembly requirements.
Why Choose EP4S100G5F45I1?
The EP4S100G5F45I1 combines a high logic-element count, substantial embedded memory, and extensive I/O in an industrial-grade FCBGA package, offering a balanced platform for demanding programmable-logic applications. Its defined core voltage window and surface-mount package support practical system-level power and mechanical integration.
This device is well suited to engineering teams developing complex digital systems that require scalable logic capacity, significant on-chip memory, and large I/O counts within an industrial temperature envelope—providing a clear hardware foundation for mid- to high-density FPGA designs.
Request a quote or submit a product inquiry to receive pricing, availability, and ordering information for the EP4S100G5F45I1 STRATIX® IV GT FPGA.

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