EP4S100G4F45I3

The EP4S100G4F45I3 is a STRATIX® IV GT Field Programmable Gate Array (FPGA) IC from Intel. It delivers a large programmable fabric and substantial embedded memory in a compact FCBGA package.

This device provides 353,600 logic elements, approximately 23.1 Mbits of on-chip RAM, and up to 781 I/O pins, making it suited for designs that require high logic capacity, significant embedded memory, and dense I/O. It is supplied in a 1932‑BBGA (FCBGA) package, operates from a 920 mV to 980 mV core supply, and is specified for industrial operation from 0 °C to 100 °C.

Key Features

• FPGA Core STRATIX® IV GT architecture implemented in an Intel-manufactured FPGA IC for large-scale programmable logic integration.
• Logic Capacity 353,600 logic elements with 14,144 logic array blocks (LABs) to support complex digital designs and high gate counts.
• Embedded Memory Approximately 23.1 Mbits of on-chip RAM for buffering, data storage, and implementation of memory-intensive functions.
• I/O Density 781 I/O pins to accommodate a wide range of external interfaces and parallel connectivity requirements.
• Power Core voltage supply specified from 920 mV to 980 mV to match low-voltage system domains.
• Package and Mounting 1932‑BBGA FCBGA package (supplier device package: 1932‑FBGA, FC 45×45) with surface-mount assembly for compact board integration.
• Temperature and Grade Industrial grade device specified for an operating range of 0 °C to 100 °C.

Unique Advantages

• High programmable density: 353,600 logic elements enable implementation of large-scale logic functions and complex system integrations on a single device.
• Substantial embedded memory: Approximately 23.1 Mbits of on-chip RAM reduces external memory dependencies and speeds data-path implementations.
• Extensive I/O capability: 781 I/O pins provide flexibility for interfacing multiple peripherals, buses, and parallel signals.
• Industrial-grade operation: Rated for 0 °C to 100 °C, supporting designs targeted for industrial environments.
• Compact FCBGA package: 1932‑BBGA (45×45) footprint offers a dense solution for space-constrained PCBs while maintaining high pin count.
• Low-voltage core compatibility: 920–980 mV supply range aligns with modern low-voltage system architectures.

Why Choose EP4S100G4F45I3?

The EP4S100G4F45I3 combines large logic capacity, significant embedded RAM, and a high I/O count in a compact industrial-grade FCBGA package. These characteristics make it suitable for designs that require substantial on-chip resources and dense external connectivity while operating within a 0 °C to 100 °C temperature window.

For engineers and procurement teams seeking a programmable solution with considerable integration potential, EP4S100G4F45I3 offers a balance of logic density, memory, and I/O in a surface-mount 1932‑BBGA package backed by Intel manufacturing.

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