EP4S100G4F45I3N

The EP4S100G4F45I3N is a STRATIX® IV GT Field Programmable Gate Array (FPGA) manufactured by Intel. It provides a large logic capacity and substantial embedded RAM in a high-density FCBGA package suitable for industrial applications.

With 353,600 logic elements, approximately 23.1 Mbits of embedded memory and 781 I/O pins, this device is intended for designs that require extensive on-chip logic, significant on-chip memory, and broad external connectivity within an industrial temperature range.

Key Features

• Core / Architecture  STRATIX® IV GT family FPGA, provided as the EP4S100G4F45I3N device from Intel.
• Logic Capacity  353,600 logic elements to implement large-scale programmable logic and custom digital functions.
• Embedded Memory  Approximately 23.1 Mbits of on-chip RAM for buffering, storage, and on-chip data processing.
• I/O Resources  781 I/O pins to support extensive external interfaces and board-level connectivity.
• Power Supply  Core voltage supply range of 920 mV to 980 mV, enabling defined system-level power design.
• Package & Mounting  1932-ball BGA (FCBGA) in a 45×45 mm supplier package; surface-mount device for compact board integration.
• Operating Conditions  Industrial-grade operating temperature range of 0 °C to 100 °C for use in temperature-controlled industrial environments.
• Environmental Compliance  RoHS compliant to meet common lead-free process and environmental requirements.

Typical Applications

• Industrial Automation  Implementation of control logic and interface aggregation where a large number of logic elements and I/Os enable system consolidation.
• Signal Processing and Data Buffering  On-chip RAM capacity supports local buffering and intermediate storage for complex data manipulation tasks.
• High-Density Board Designs  FCBGA package and surface-mount mounting allow compact integration into systems that require significant programmable logic in a small footprint.

Unique Advantages

• Substantial Logic Capacity: 353,600 logic elements allow implementation of large and complex digital designs on a single device, reducing the need for multiple FPGAs.
• Significant On-Chip Memory: Approximately 23.1 Mbits of embedded RAM support local storage and data path optimization without external memory dependency.
• Extensive I/O Count: 781 I/Os provide broad connectivity options for multiplexed interfaces, sensors, peripherals, and board-level signals.
• Industrial Temperature Rating: Rated 0 °C to 100 °C for deployments in industrial environments with controlled temperature profiles.
• Compact, High-Density Packaging: 1932-ball FCBGA (45×45 mm) supports dense board-level integration and minimizes PCB area for the FPGA solution.
• RoHS Compliant: Meets lead-free environmental compliance requirements for modern manufacturing processes.

Why Choose EP4S100G4F45I3N?

The EP4S100G4F45I3N delivers a combination of large logic capacity, substantial embedded memory, and a high I/O count in a compact FCBGA package suitable for industrial applications. Its specified core voltage range and RoHS compliance make it compatible with defined system power designs and modern manufacturing requirements.

This device is well suited to engineers and procurement teams seeking a single-FPGA solution for complex, high-density programmable logic tasks in industrial environments, where on-chip memory and plentiful I/O reduce the need for additional components and simplify system architecture.

Request a quote or submit your specifications to receive pricing and availability information for the EP4S100G4F45I3N. Our team can assist with lead times, ordering, and technical clarifications specific to this Intel STRATIX® IV GT FPGA.