EP4S100G4F45I2

The EP4S100G4F45I2 is a STRATIX® IV GT Field Programmable Gate Array (FPGA) from Intel offered in a 1932-BBGA FCBGA package. It provides a large on-chip resource set including approximately 353,600 logic elements, approximately 23.1 Mbits of embedded memory, and 781 user I/O pins for complex, high-density designs.

Configured for surface-mount deployment and specified for industrial-grade operation, this device targets applications that require substantial logic, memory and I/O integration within a compact package and an operating voltage window of 920 mV to 980 mV.

Key Features

• Core Logic  Approximately 353,600 logic elements to implement large-scale, custom digital designs.
• Embedded Memory  Approximately 23.1 Mbits of on-chip RAM for buffering, lookup tables and data storage close to logic.
• I/O Capacity  781 user I/O pins to support dense external connectivity and multiple parallel interfaces.
• Power  Specified supply voltage range of 920 mV to 980 mV for core power planning and system integration.
• Package & Mounting  1932-BBGA (FCBGA) package, supplier device package 1932-FBGA (45×45), designed for surface-mount assembly.
• Temperature Range  Industrial operating temperature range from 0 °C to 100 °C for deployment in temperature-controlled industrial environments.
• Compliance  RoHS compliant to meet standard environmental requirements.

Typical Applications

• Industrial Control and Automation  Leverages industrial-grade temperature rating, extensive I/O and large logic/memory resources for control, sequencing and real-time processing in factory or process systems.
• Data Acquisition and Processing  On-chip memory and abundant logic elements enable aggregation, buffering and custom preprocessing of sensor or measurement data.
• Test & Measurement Equipment  High logic capacity and substantial I/O allow implementation of complex instrumentation logic, timing control and interface handling.

Unique Advantages

• High logic density: Approximately 353,600 logic elements support large, partitioned designs and advanced custom logic functions without external processors.
• Significant on-chip memory: Approximately 23.1 Mbits of embedded RAM reduces external memory dependency and lowers system latency for data buffering and lookup tasks.
• Extensive external connectivity: 781 user I/Os provide flexibility to connect sensors, peripherals and parallel interfaces directly to the FPGA fabric.
• Industrial operating range: 0 °C to 100 °C rating aligns with many industrial deployment scenarios that require stable operation in controlled industrial environments.
• Compact FCBGA package: 1932-BBGA (45×45) footprint delivers high integration density for space-constrained PCBs while supporting surface-mount assembly.
• Manufacturer provenance: Produced by Intel, providing traceability to a major FPGA supplier.

Why Choose EP4S100G4F45I2?

The EP4S100G4F45I2 is positioned for designers who need substantial programmable logic, embedded memory and extensive I/O in a single industrial-grade FPGA package. Its combination of approximately 353,600 logic elements, roughly 23.1 Mbits of on-chip RAM and 781 I/Os supports complex control, data handling and instrumentation tasks within a compact FCBGA footprint.

This device is suitable for teams building robust, high-density FPGA-based systems where predictable operating temperature range, precise core voltage planning and surface-mount packaging are important considerations. Backed by Intel manufacturing, it fits designs that prioritize integration and long-term availability.

If you need pricing, availability or a formal quote for EP4S100G4F45I2, request a quote to receive detailed information and lead-time options.