EP4S100G3F45I3N

The EP4S100G3F45I3N is a STRATIX® IV GT Field Programmable Gate Array (FPGA) IC from Intel, supplied in a 1932-BBGA FCBGA package. It provides a high-density programmable fabric with substantial embedded memory and a large I/O count for complex digital designs.

Designed for industrial environments, this device targets applications that require substantial logic capacity, on-chip RAM, and extensive external interfacing within a compact ball-grid array package. Key value propositions include high integration, large I/O availability, and defined industrial operating conditions.

Key Features

• Logic Capacity  291,200 logic elements for implementing large-scale digital designs and custom logic functions.
• Embedded Memory  Approximately 17.7 Mbits of on-chip RAM to support buffering, state storage, and embedded data processing without extensive external memory.
• I/O Density  781 available I/Os to support multi-channel interfaces, high-pin-count peripherals, and system-level connectivity.
• Power Supply  Specified core voltage range of 920 mV to 980 mV to match board-level power budgeting and regulator selection.
• Package  1932-BBGA (supplier device package: 1932-FBGA, FC, 45×45) to deliver a compact, high-pin-count footprint suitable for dense system boards.
• Operating Range  Industrial-grade operation from 0°C to 100°C for deployment in controlled industrial environments.
• Environmental Compliance  RoHS compliant, meeting common environmental and manufacturing requirements.

Typical Applications

• High-density digital processing  Use the large logic element count and on-chip RAM for data-path, signal processing, and protocol handling tasks that require significant programmable logic.
• Multi-interface communication platforms  Leverage 781 I/Os to aggregate and route numerous serial and parallel interfaces in communications or networking equipment.
• Industrial control and automation  Industrial-grade temperature range and extensive I/O support sensor interfacing, motor control logic, and machine control coordination.
• Custom hardware acceleration  Implement application-specific accelerators and offload compute tasks to reduce system-level latency using the device’s logic and embedded memory resources.

Unique Advantages

• Highly integrated solution: 291,200 logic elements combined with on-chip RAM reduce the need for external components and simplify board-level design.
• Extensive I/O capability: 781 I/Os allow direct connection to multiple peripherals and interfaces without large external multiplexing.
• Compact high-pin-count package: The 1932-BBGA (45×45) footprint enables dense routing and space-efficient system integration.
• Industrial temperature rating: Rated 0°C to 100°C to meet the operational needs of industrial systems.
• Low-voltage core operation: 920 mV to 980 mV supply range supports efficient core power budgeting on multi-rail boards.
• RoHS compliant: Conforms to common environmental manufacturing standards for lead-free production.

Why Choose EP4S100G3F45I3N?

The EP4S100G3F45I3N positions itself as a high-density STRATIX® IV GT FPGA that combines large logic capacity, substantial embedded memory, and a very high I/O count in a compact FCBGA package. Its industrial operating range and RoHS compliance make it suitable for robust system designs where integrated logic and extensive interfacing are required.

This device is well suited for engineers and procurement teams building complex digital systems—such as communications platforms, industrial controllers, and custom acceleration hardware—who need a programmable, high‑capacity FPGA that fits into space-constrained, high-pin-count board layouts.

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