EP4S100G3F45I3G

The EP4S100G3F45I3G is an Intel FPGA in the Stratix IV device family offered in an industrial-grade surface-mount FCBGA package. It provides a high logic capacity fabric with extensive I/O and substantial on-chip memory for demanding embedded and system-level applications.

Series-level documentation for the Stratix IV family highlights architecture features such as high-speed transceivers, embedded memory and DSP resources, and flexible I/O and clocking — capabilities relevant to designs requiring programmable logic, large I/O counts and robust memory resources.

Key Features

• Logic Capacity  291,200 logic elements for complex programmable logic and large-scale integration.
• Embedded Memory  Approximately 17.66 Mbits of on-chip RAM to support buffering, packet processing, and large local data structures.
• I/O Density  781 user I/Os enabling wide external connectivity and multi-interface designs.
• Package & Mounting  1932-BBGA / FCBGA package in supplier format 1932-FBGA, FC (45×45) with surface-mount mounting suited to board-level integration.
• Power Supply  Core supply range specified at 920 mV to 980 mV to match platform power delivery requirements.
• Operating Temperature  Industrial temperature grade with an operating range of −40 °C to 100 °C for deployment in temperature-challenging environments.
• Compliance  RoHS compliant for environmental and regulatory compatibility.
• Series-Level Capabilities  Stratix IV family documentation notes features such as high-speed transceivers, DSP blocks, flexible clock networks and external memory interfaces that align with this device’s architecture.

Typical Applications

• High-speed communications and networking  Large logic capacity, extensive I/O and series-level transceiver support enable packet processing, interface bridging and protocol handling.
• Digital signal processing and video  Substantial embedded memory and device-level DSP resources suit real-time signal processing, video pipelines and buffering tasks.
• Industrial control and instrumentation  Industrial-grade temperature rating and high I/O count make the device appropriate for complex control, sensor aggregation and protocol conversion.

Unique Advantages

• High programmable density: 291,200 logic elements allow consolidation of multiple functions into a single FPGA, reducing board-level component count.
• Significant on-chip memory: Approximately 17.66 Mbits of embedded RAM supports large buffers and local data storage, improving latency and throughput for streaming applications.
• Extensive connectivity: 781 I/Os provide flexibility for multi-protocol interfacing and dense external device connections without external multiplexing.
• Designed for industrial environments: −40 °C to 100 °C operating range supports deployment in harsher ambient conditions.
• Standard surface-mount FCBGA package: 1932-FBGA, FC (45×45) package supports high-density board integration and reliable mounting for production assemblies.
• Regulatory compatibility: RoHS compliance simplifies environmental compliance for shipped assemblies.

Why Choose EP4S100G3F45I3G?

The EP4S100G3F45I3G combines large logic resources, extensive embedded memory and a very high I/O count in an industrial-grade FCBGA package, making it suitable for system designs that require on-device integration of complex logic, buffering and multi-interface connectivity. Its documented Stratix IV family architecture provides a foundation of high-speed transceiver support, DSP capability and flexible clocking useful for communications, signal processing and advanced control systems.

This part is well suited to designers and teams targeting scalable, integrated FPGA-based solutions for industrial and high-performance embedded applications that require verified series-level capabilities and a high degree of programmability.

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