EP4S100G3F45I2

The EP4S100G3F45I2 is an Intel STRATIX® IV GT field programmable gate array (FPGA) delivered in a high-density 1932-FBGA package. It provides substantial programmable logic resources, on-chip memory, and a large I/O count tailored for complex, integration-heavy designs in industrial environments.

With 291,200 logic elements, approximately 17.66 Mbits of embedded memory, and 781 user I/Os, this device addresses compute- and I/O-intensive applications that require significant on-chip resources while operating across an industrial temperature range.

Key Features

• Logic Capacity  291,200 logic elements to implement large-scale, custom digital architectures and complex processing pipelines.
• Embedded Memory  Approximately 17.66 Mbits of on-chip RAM for buffering, LUT storage, and local data structures.
• I/O Density  781 user I/O pins to support wide parallel interfaces, multi-channel data acquisition, or high-pin-count connectivity.
• Power Supply  Core voltage range of 920 mV to 980 mV, enabling precise power budgeting for core logic domains.
• Package  1932-FBGA / 1932-BBGA FCBGA package (45×45), providing a compact platform for high-density system integration.
• Thermal & Grade  Industrial-grade device rated for operation from 0 °C to 100 °C for deployment in industrial temperature environments.
• Mounting  Surface-mount package suitable for modern assembly and production workflows.

Typical Applications

• High-density signal processing  Use the 291,200 logic elements and on-chip RAM to implement DSP pipelines, data aggregation, and real-time processing chains.
• Industrial control systems  Industrial-grade temperature rating and extensive I/O support system-level control, motor drives, and sensor interfacing.
• Communication infrastructure  Large I/O count and significant logic capacity support protocol handling, packet processing, and interface bridging in network equipment.

Unique Advantages

• Substantial on-chip resources: Combines 291,200 logic elements with approximately 17.66 Mbits of embedded memory to reduce external component count and simplify board design.
• High I/O availability: 781 user I/Os allow direct interfacing to many peripherals and parallel data channels without additional expansion chips.
• Industrial-ready operation: Rated for 0 °C to 100 °C and specified as industrial grade for deployments in factory and industrial environments.
• Compact, high-density package: 1932-FBGA (45×45) packaging enables dense PCB layouts while accommodating large logic and I/O capacity.
• Low-voltage core operation: Core supply range of 920 mV to 980 mV supports precise power management strategies for optimized thermal and power designs.

Why Choose EP4S100G3F45I2?

The EP4S100G3F45I2 positions itself for system designs that require a high level of integration—large programmable logic resources, significant embedded memory, and abundant I/O—delivered in a production-ready industrial package. Its combination of capacity and I/O density makes it suitable for customers building complex signal processing, communication, or industrial control solutions.

Backed by Intel's STRATIX IV GT FPGA architecture and provided in a compact 1932-FBGA package, this device offers a scalable hardware platform for long-term designs that demand reliability, on-chip resource density, and flexible interfacing options.

Request a quote or submit a sales inquiry today to check availability and pricing for the EP4S100G3F45I2.