EP4S100G3F45I1G
| Part Description |
Field Programmable Gate Array (FPGA) IC |
|---|---|
| Quantity | 1,628 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 781 | Voltage | 920 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 11648 | Number of Logic Elements/Cells | 291200 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 17661952 |
Overview of EP4S100G3F45I1G – Field Programmable Gate Array (FPGA) IC
The EP4S100G3F45I1G is an Intel Stratix IV family FPGA device offering high logic density and extensive I/O in a single surface-mount FCBGA package. It targets designs that require significant on-chip logic, embedded memory, and flexible I/O while operating across a wide industrial temperature range.
Built on the Stratix IV device architecture described in the device handbook, this FPGA supports series-level capabilities such as high-speed transceivers, DSP blocks, and advanced clocking and PLL resources to address networking, signal processing, and system-integration use cases.
Key Features
- High logic capacity — 291,200 logic elements to implement complex digital logic and custom accelerators.
- Embedded memory — approximately 17.66 Mbits of on-chip RAM to support buffering, packet processing, and local data storage.
- Extensive I/O — 781 user I/O pins for broad interfacing options to external devices and systems.
- Stratix IV architecture features — series-level design includes high-speed transceiver features, digital signal processing (DSP) blocks, advanced clock networks, and PLLs as described in the Stratix IV device handbook.
- Power and core supply — core voltage specified at 920 mV to 980 mV to match system power rails and regulator designs.
- Package and mounting — available in a 1932-ball FCBGA supplier package (1932-FBGA, FC, 45×45), surface-mount mounting for compact board designs.
- Industrial temperature grade — rated for operation from −40 °C to 100 °C for reliable performance in industrial environments.
- System-level interfaces — series documentation highlights external memory interfaces and high-speed differential I/O capabilities for system integration.
Typical Applications
- High-speed communications and networking — use the Stratix IV transceiver and dense logic resources for packet processing, interface bridging, and protocol handling.
- Signal processing and acceleration — leverage on-chip DSP blocks and large embedded RAM for real-time filtering, FFTs, and hardware acceleration tasks.
- Industrial control and automation — industrial temperature rating and extensive I/O allow deployment in factory and process-control systems requiring deterministic logic and interfaces.
- High-density computing modules — integrate large logic capacity and memory in compact FCBGA form factors for compute and data-path modules.
Unique Advantages
- Substantial logic resources: 291,200 logic elements enable implementation of large, complex designs without immediate partitioning across multiple devices.
- Significant on-chip memory: approximately 17.66 Mbits of embedded RAM reduces external memory dependence and improves latency for buffering and data processing.
- Broad I/O count: 781 I/Os provide flexibility to connect multiple peripherals, memory buses, and external interfaces directly to the FPGA.
- Industrial operating range: −40 °C to 100 °C rating supports deployment in temperature-challenging industrial environments.
- Integrated Stratix IV capabilities: architecture-level features such as DSP blocks, PLLs, clock networks, and high-speed I/O provide a foundation for high-performance system designs.
- Compact surface-mount packaging: 1932-ball FCBGA (45×45) offers a high-density solution for space-constrained board layouts.
Why Choose EP4S100G3F45I1G?
The EP4S100G3F45I1G positions itself as a high-capacity Stratix IV FPGA option for engineers needing ample logic, embedded memory, and a large I/O complement in an industrial-grade, surface-mount package. Its combination of on-chip resources and series-level architecture features supports demanding applications in communications, signal processing, and industrial systems.
For designs that require scalability and robust hardware resources, this Intel Stratix IV device provides a clear platform choice, backed by the family-level documentation and architecture described in the device handbook.
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