EP4S100G2F40I3G

The EP4S100G2F40I3G is a Stratix IV GT Field Programmable Gate Array (FPGA) in a 1517-BBGA (1517-FBGA, 40×40) package designed for demanding industrial applications. Based on the Stratix IV architecture and TSMC 40‑nm process technology, this device combines a high logic capacity, substantial on‑chip memory, and a large I/O count to support complex, high‑bandwidth system designs.

This FPGA targets applications that require significant logic density, flexible I/O connectivity, and robust thermal and voltage operating ranges typical of industrial deployments.

Key Features

• Logic Capacity — 228,000 logic elements to implement large-scale digital designs and complex custom logic functions.
• Embedded Memory — Approximately 17.5 Mbits of on‑chip RAM (17,544,192 total RAM bits) for buffering, FIFOs, and memory‑intensive logic.
• I/O Resources — 654 user I/O pins to support wide external interface options and high‑pin‑count system integration.
• Power Supply — Core voltage operation from 860 mV to 1.15 V for compatibility with typical FPGA power architectures.
• Package & Mounting — 1517‑BBGA FCBGA package (supplier package: 1517‑FBGA, 40×40) with surface‑mount construction for compact board designs.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• Compliance — RoHS compliant.
• Stratix IV GT Family Characteristics — Device built on Stratix IV GT architecture (Stratix IV device handbook) leveraging the 40‑nm process and family features for high bandwidth and integration.

Typical Applications

• High‑density digital processing — Implement large custom datapaths, protocol engines, and packet processing where extensive logic and on‑chip memory are required.
• Telecommunications and networking — Support complex interface aggregation and protocol handling that benefit from high I/O counts and substantial embedded RAM.
• Industrial control systems — Deploy in industrial automation and control platforms that need industrial temperature operation and a high degree of configurable logic.
• Prototype and system integration — Use as a scalable platform for hardware proof‑of‑concepts and integration of multiple peripheral interfaces on a single device.

Unique Advantages

• High logic density: 228K logic elements provide capacity for large, consolidated designs that reduce the need for multiple devices.
• Substantial on‑chip memory: Approximately 17.5 Mbits of embedded RAM enables deep buffering and memory‑centric algorithms without external memory for many functions.
• Extensive I/O: 654 I/Os simplify board‑level routing and reduce interface multiplexing, accelerating system integration.
• Industrial robustness: Rated −40 °C to 100 °C and RoHS compliant, making the device suitable for industrial deployment and regulatory compliance.
• Compact package: 1517‑BBGA (40×40) FCBGA provides a high‑density, surface‑mount footprint for space‑constrained PCBs.
• Established architecture: Based on the Stratix IV GT family and documented in the Stratix IV device handbook for consistent design reference and development workflow.

Why Choose EP4S100G2F40I3G?

The EP4S100G2F40I3G is positioned for designers who need a high‑capacity, industrial‑rated FPGA with substantial embedded memory and a large number of I/Os in a compact BGA package. Its Stratix IV GT heritage and 40‑nm process foundation provide a balanced combination of logic resources, memory, and system connectivity for complex digital, networking, and industrial control applications.

Choose this device when your design requires consolidation of multiple functions into a single FPGA, reliable operation over wide temperatures, and a documented family platform to support development and deployment needs.

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