EP4S100G3F45I1

The EP4S100G3F45I1 is a STRATIX® IV GT Field Programmable Gate Array (FPGA) offered in a 1932-BBGA FCBGA package. It delivers a high logic-capacity programmable solution with on-chip memory and a large I/O complement for complex system designs.

Designed for industrial-grade applications, this surface-mount FPGA integrates 291,200 logic elements and approximately 17.66 Mbits of embedded memory, supports 781 I/O pins, and operates from a 920 mV to 980 mV supply over a 0 °C to 100 °C operating range.

Key Features

• Core Logic  291,200 logic elements provide substantial programmable fabric for implementing complex digital designs.
• Embedded Memory  Approximately 17.66 Mbits of on-chip RAM to store buffers, lookup tables, and state data without external memory dependence.
• I/O Capacity  781 user I/O pins enable dense peripheral connectivity and flexible interface options for I/O-heavy systems.
• Power  Operates from a supply range of 920 mV to 980 mV, allowing designers to plan power delivery and sequencing precisely.
• Package & Mounting  Supplied in a 1932-BBGA (1932-FBGA, FC 45×45) package and intended for surface-mount assembly to support compact, high-density board layouts.
• Temperature & Grade  Industrial grade with an operating temperature range of 0 °C to 100 °C for deployment in factory and industrial environments.
• Environmental Compliance  RoHS compliant for meet current lead-free and materials restrictions requirements.

Typical Applications

• Industrial Control  Programmable logic and substantial I/O make this FPGA suitable for control systems, machine automation interfaces, and factory equipment where industrial-grade components are required.
• High-Density Logic Designs  Large logic element count and embedded memory enable complex state machines, signal processing pipelines, and custom compute blocks within a single device.
• Data Acquisition & I/O Aggregation  Extensive I/O count supports aggregation of sensors, converters, and peripheral interfaces for data collection and preprocessing at the edge.

Unique Advantages

• High Logic Density: 291,200 logic elements allow consolidation of multiple functions onto one FPGA, reducing board-level parts count.
• Significant On-Chip Memory: Approximately 17.66 Mbits of embedded RAM supports buffering and local data storage, lowering dependence on external memory.
• Large I/O Complement: 781 I/O pins provide flexibility for interfacing with many peripherals and parallel buses without external expander chips.
• Industrial Grade Reliability: Specified for 0 °C to 100 °C operation and labeled industrial grade to match demanding factory and control environments.
• Compact, High-Density Package: 1932-BBGA (45×45) packaging delivers a small footprint for high-functionality designs in space-constrained systems.
• Regulatory Alignment: RoHS compliance supports environmental and manufacturing requirements for modern electronics production.

Why Choose EP4S100G3F45I1?

The EP4S100G3F45I1 combines substantial programmable logic capacity, ample embedded memory, and a high I/O count in a compact 1932-BBGA surface-mount package suited for industrial deployments. Its specified supply range and operating temperature window help integrate the device into controlled industrial power and thermal environments.

This FPGA is appropriate for engineers and teams building complex, I/O-intensive systems that benefit from high on-chip logic and memory integration—enabling reduced BOM, tighter system integration, and simplified board-level design while meeting RoHS requirements.

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