EP4S100G3F45I1N

The EP4S100G3F45I1N is a STRATIX® IV GT Field Programmable Gate Array (FPGA) from Intel, designed to provide high logic density and extensive connectivity in a compact FCBGA package. With 291,200 logic elements and approximately 17.66 Mbits of embedded memory, the device targets complex, I/O‑rich designs that require substantial on‑chip logic and memory resources.

Specified for industrial‑grade operation and surface‑mount assembly, this FPGA supports a core supply range of 920 mV to 980 mV and an operating temperature range of 0°C to 100°C, making it suitable for robust, continuously operating systems.

Key Features

• Logic Capacity 291,200 logic elements to implement complex digital functions and custom accelerators within a single device.
• Embedded Memory Approximately 17.66 Mbits of on‑chip RAM to support data buffering, frame storage, and intermediate processing without immediate reliance on external memory.
• High I/O Count 781 I/O pins to accommodate large numbers of interfaces, multi‑lane connectivity, and dense external device integration.
• Power and Core Supply Core voltage range of 920 mV to 980 mV for defined power rail integration and supply planning.
• Package and Mounting 1932‑BBGA (FCBGA) package, supplier device package 1932‑FBGA, FC (45×45), delivered in a surface‑mount form factor for high‑pin‑count, board‑level integration.
• Industrial Grade Rated for an operating temperature range of 0°C to 100°C, suitable for continuous operation in industrial environments.
• RoHS Compliant Meets RoHS requirements for lead‑free, environmentally conscious assembly.

Typical Applications

• High‑density digital processing Implement custom signal processing pipelines, accelerators, and large combinational/sequential logic blocks using the device's abundant logic elements and embedded RAM.
• Multi‑interface systems Integrate numerous external peripherals and parallel interfaces leveraging the 781 available I/O pins for flexible system connectivity.
• Industrial control and automation Deploy in industrial equipment where sustained operation and the 0°C to 100°C temperature range are required for reliable control logic and I/O handling.

Unique Advantages

• High logic density: 291,200 logic elements enable consolidation of multiple functions into a single device, reducing board complexity and BOM count.
• Substantial on‑chip memory: Approximately 17.66 Mbits of embedded RAM supports large buffers and temporary data storage, minimizing dependence on external RAM for many use cases.
• Extensive connectivity: 781 I/O pins allow direct connection to numerous peripherals and parallel interfaces, simplifying routing for complex systems.
• Industrial rating: Specified 0°C to 100°C operation and industrial grade classification support deployment in demanding, continuously operating environments.
• Compact high‑pin package: The 1932‑FBGA (45×45) FCBGA package delivers a high pin count in a space‑efficient surface‑mount footprint for dense board designs.
• Regulatory compliance: RoHS compliance supports lead‑free manufacturing processes and environmental requirements.

Why Choose EP4S100G3F45I1N?

The EP4S100G3F45I1N combines very large logic capacity, considerable embedded memory, and one of the highest I/O counts available in a single STRATIX® IV GT FPGA package. This configuration is well suited to developers and system integrators who need to consolidate complex digital functions and extensive connectivity into a single, industrial‑rated device.

Manufactured by Intel and provided in a 1932‑FBGA surface‑mount package, the device offers a compact platform for scaling logic‑intensive designs while meeting RoHS and industrial environmental requirements. Its defined supply range and operating temperature make it appropriate for long‑running systems that require predictable electrical and thermal behavior.

Request a quote or submit an inquiry to obtain pricing and availability for the EP4S100G3F45I1N. Our team will respond with a formal quote and lead‑time information tailored to your project needs.