EP4S100G3F45I3

The EP4S100G3F45I3 is an Intel STRATIX® IV GT Field Programmable Gate Array (FPGA) offered in a high-density FCBGA package and specified for industrial use. It delivers substantial on-chip logic capacity and embedded memory with a very large I/O count, addressing designs that require extensive logic resources and complex system interfacing.

With a supply voltage range tailored for modern power domains and an industrial operating temperature window, this device is suited to long-running, board-level applications where integration density and reliable operation across typical industrial temperatures are important.

Key Features

• Logic Capacity — 291,200 logic elements to support large-scale, complex custom logic implementations.
• Embedded Memory — Approximately 17.66 Mbits of on-chip RAM for data buffering, frame storage, and intermediate processing without external memory.
• I/O Count — 781 user I/Os to simplify board-level interfacing with sensors, peripherals, and high-pin-count connectors.
• Package & Mounting — 1932-BBGA, FCBGA package (supplier device package listed as 1932-FBGA, FC (45x45)) in a surface mount form factor for dense PCB integration.
• Power — Core supply range from 920 mV to 980 mV to match low-voltage system rails.
• Temperature Range — Rated for operation from 0 °C to 100 °C suitable for industrial ambient conditions.
• Compliance — RoHS compliant to support environmentally conscious manufacturing and procurement.

Typical Applications

• Industrial Control Systems — Use the device’s high logic density and large I/O count for complex motor control, PLC logic expansion, and factory automation interfaces.
• Data Processing & Acceleration — Leverage abundant logic elements and embedded RAM for on-board data manipulation, packet processing, and custom accelerators.
• High‑pin‑count System Integration — The 781 I/Os enable direct connectivity to multiple peripherals, sensors, and high-speed interfaces on a single board.

Unique Advantages

• High logic integration: 291,200 logic elements reduce the need for multiple discrete devices and simplify system partitioning.
• Significant on‑chip memory: Approximately 17.66 Mbits of embedded RAM supports buffering and state storage without immediate external memory dependencies.
• Extensive I/O availability: 781 user I/Os enable complex system interconnects and minimize external multiplexing.
• Industrial temperature rating: 0 °C to 100 °C operation aligns with typical industrial ambient requirements for continuous operation.
• Compact, high-density package: 1932-BBGA / 1932-FBGA package supports dense routing and high pin-count designs in a surface-mount form factor.
• RoHS compliant: Meets common environmental compliance expectations for electronic manufacturing.

Why Choose EP4S100G3F45I3?

The EP4S100G3F45I3 positions itself for designs that demand large programmable logic capacity, substantial embedded memory, and an above-average I/O complement in an industrial-grade FPGA. Its combination of 291,200 logic elements, approximately 17.66 Mbits of on-chip RAM, and 781 I/Os make it well suited to system‑level designs that consolidate functionality onto a single FPGA footprint.

For engineering teams and procurement focused on scalable, high-density FPGA solutions from a recognized manufacturer, this STRATIX IV GT device offers a robust option for long-running industrial applications where integration density and reliable operation across a standard industrial temperature range are required.

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