EP4S100G3F45I2G

IC FPGA 781 I/O 1932FCBGA
Part Description

Field Programmable Gate Array (FPGA) IC

Quantity 569 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O781Voltage920 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11648Number of Logic Elements/Cells291200
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits17661952

Overview of EP4S100G3F45I2G – Field Programmable Gate Array (FPGA) IC

The EP4S100G3F45I2G is an Intel Stratix IV series FPGA offering high logic density and extensive I/O in a single surface-mount FCBGA package. It combines a large number of logic resources, embedded memory, and architecture-level features documented in the Stratix IV Device Handbook to address high-bandwidth and compute-intensive designs.

Designed for industrial-grade applications, the device targets use cases that require substantial on-chip logic, a large I/O count, and robust temperature range support while operating within a 920 mV to 980 mV core supply window.

Key Features

  • Logic Capacity — 11648 logic array blocks (CLBs) and 291,200 logic elements provide extensive programmable fabric for complex digital designs.
  • Embedded Memory — Approximately 17.66 Mbits of on-chip RAM (17,661,952 bits) for buffering, caches, and on-chip data storage.
  • I/O Density — 781 I/O pins to support wide external connectivity and parallel interfaces.
  • Stratix IV Architecture Features — Includes architecture elements referenced in the Stratix IV Device Handbook such as high-speed transceiver features, DSP blocks, PLLs, and clock network capabilities for high-bandwidth and timing-critical applications.
  • Package and Mounting — 1932-ball FCBGA package (supplier device package: 1932-FBGA, FC 45×45); surface-mount mounting for compact, high-pin-count PCB designs.
  • Power — Core voltage supply range from 920 mV to 980 mV, enabling defined supply planning for system power delivery.
  • Operating Range — Industrial-grade temperature rating from −40 °C to 100 °C for reliable operation across demanding environments.
  • Compliance — RoHS compliant.

Typical Applications

  • High‑speed communications and networking — Uses on-chip transceiver and I/O resources to implement protocol interfaces and packet processing pipelines.
  • Signal processing and acceleration — Large logic and DSP-capable architecture support complex signal-processing chains and hardware acceleration tasks.
  • External memory interface controllers — Embedded memory combined with Stratix IV external memory interface features enables high-throughput memory controller and buffering designs.
  • Industrial control and instrumentation — Industrial temperature rating and high I/O count support sensor interfacing, motor control logic, and real-time data aggregation.

Unique Advantages

  • High logic density: 291,200 logic elements and 11,648 CLBs allow implementation of large, complex designs without multiple devices.
  • Substantial embedded memory: Approximately 17.66 Mbits of on-chip RAM reduces dependency on external memory for many buffering and caching needs.
  • Extensive I/O capability: 781 I/O pins enable broad connectivity options and support for wide parallel interfaces or multiple serial links.
  • Industrial temperature range: Rated from −40 °C to 100 °C for deployment in temperature-demanding environments.
  • Documented Stratix IV feature set: Architecture elements and system-level capabilities are described in the Stratix IV Device Handbook, aiding design integration and verification.

Why Choose EP4S100G3F45I2G?

The EP4S100G3F45I2G positions itself as a high-density, industrial-grade FPGA option within the Stratix IV family, combining significant logic capacity, embedded memory, and a large number of I/Os in a single 1932-ball FCBGA package. Its documented architecture features—such as high-speed transceiver support, DSP resources, and comprehensive clocking/PLL options—make it suitable for high-throughput and compute-intensive system designs.

This device is well suited to engineers and system designers who need a scalable FPGA platform with proven architecture documentation and well-defined electrical and thermal operating ranges. The combination of logic, memory, and I/O resources provides a pathway to consolidate functions, reduce board-level complexity, and support long-term deployment in industrial environments.

Request a quote or submit an inquiry to get pricing and availability information for EP4S100G3F45I2G and to discuss how it fits your design requirements.

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