EP4S100G3F45I2N

The EP4S100G3F45I2N is a STRATIX® IV GT Field Programmable Gate Array IC delivering high logic density and system-level integration in a 1932-ball FCBGA package. The device combines a large pool of logic elements, substantial embedded RAM, and a high I/O count to address demanding programmable-logic applications.

Designed for industrial-grade deployments, this surface-mount FPGA is specified for a 0 °C to 100 °C operating range and RoHS compliance, with documented subsystem specifications in the device handbook for transceivers, PLLs, DSP blocks, memory blocks, and configuration interfaces.

Key Features

• Core Logic Capacity  Provides 291,200 logic elements to implement complex custom logic, finite-state machines, and system glue functions.
• Embedded Memory  Includes a total of 17,661,952 bits of on-chip RAM—approximately 17.66 Mbits of embedded memory—for buffering, frame storage, and local data processing.
• I/O Resources  Offers 781 I/O pins to support wide parallel interfaces, multiple peripherals, and board-level connectivity.
• High-Speed Subsystem Documentation  The device handbook includes dedicated specifications for transceiver performance, PLLs, DSP blocks, TriMatrix memory blocks, and configuration/JTAG behavior to aid system design and validation.
• Package & Mounting  Packaged in a 1932-BBGA FCBGA (supplier package: 1932-FBGA, FC, 45×45) and intended for surface-mount assembly to support compact, high-density board designs.
• Power Supply  Specified core voltage supply range of 920 mV–980 mV to match platform power planning requirements.
• Industrial Operating Range  Rated for 0 °C to 100 °C operation and supplied as an industrial-grade device for deployed systems operating within that temperature window.
• Standards and Compliance  RoHS compliant to meet regulatory requirements for lead-free assembly.

Typical Applications

• High-speed communications systems  Use the documented transceiver and PLL specifications for building serial link interfaces and protocol bridging in networking equipment.
• Signal processing and acceleration  Leverage the DSP block specifications and large logic fabric for real-time signal processing, filtering, and FPGA-based acceleration tasks.
• Complex control and system integration  Deploy the device where high logic capacity, abundant embedded RAM, and extensive I/O are required to integrate multiple subsystems on a single FPGA.

Unique Advantages

• High logic density: 291,200 logic elements enable implementation of large, integrated designs without partitioning across multiple devices.
• Substantial on-chip memory: Approximately 17.66 Mbits of embedded RAM reduces external memory dependency for buffering and local data storage.
• Extensive I/O count: 781 I/Os provide flexibility for wide parallel data paths, multiple peripherals, and board-level interfacing.
• Documented subsystem performance: Detailed datasheet chapters covering transceivers, PLLs, DSP blocks, and memory give engineers the specifications needed for timing, signal integrity, and system integration work.
• Industrial-rated operation: 0 °C to 100 °C operating range supports deployment in industrial environments within the specified temperature window.
• Surface-mount FCBGA packaging: 1932-BBGA/1932-FBGA (45×45) packaging supports high-density board layouts and scalable system designs.

Why Choose EP4S100G3F45I2N?

The EP4S100G3F45I2N positions itself as a high-capacity, industrial-grade FPGA option for designs that require a large logic resource, substantial embedded memory, and a high number of I/Os in a single-package solution. The device handbook provides extensive, component-level specifications for key subsystems—enabling precise engineering trade-offs and validation across transceivers, PLLs, DSP blocks, and memory resources.

This FPGA is suited to engineering teams building complex communications, signal-processing, or system-integration applications that benefit from on-chip resources and documented subsystem behavior. The combination of logic density, on-chip RAM, and comprehensive datasheet guidance supports scalable designs and reliable implementation within the device’s specified voltage and temperature ranges.

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