EP4S100G4F45I1G
| Part Description |
Field Programmable Gate Array (FPGA) IC |
|---|---|
| Quantity | 788 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 781 | Voltage | 920 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 11648 | Number of Logic Elements/Cells | 353600 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 23105536 |
Overview of EP4S100G4F45I1G – Field Programmable Gate Array (FPGA) IC
The EP4S100G4F45I1G is an Intel Stratix IV family FPGA in a high-pin-count FCBGA package designed for complex, high-bandwidth digital systems. It delivers a large programmable fabric, ample embedded memory, and extensive I/O connectivity for applications that require significant logic capacity and system integration.
Built to operate across an industrial temperature range and RoHS compliant, this device is suitable for designs that demand robust environmental performance combined with the Stratix IV architecture features such as high-speed transceivers, DSP blocks, and advanced clocking resources as documented in the Stratix IV Device Handbook.
Key Features
- High logic capacity — 353,600 logic elements to implement complex algorithms, control logic, and custom accelerators.
- Embedded memory — Approximately 23.1 Mbits of on-chip RAM for buffering, packet storage, and state machines.
- Extensive I/O — 781 user I/O pins to support wide external connectivity and parallel interfaces.
- Stratix IV family architecture — Device family features include high-speed transceivers, digital signal processing (DSP) blocks, PLLs, and advanced clock networks (per the Stratix IV Device Handbook).
- Package and mounting — 1932-ball FCBGA package (45 × 45 mm) with surface-mount mounting for dense board integration.
- Industrial temperature range — Rated for operation from −40 °C to 100 °C for deployment in demanding environments.
- Low-voltage core — Core supply specified between 920 mV and 980 mV to match system power-rail planning.
- Regulatory compliance — RoHS compliant for environmental and manufacturing conformity.
Typical Applications
- High-speed communications — Use the Stratix IV transceiver and protocol support to implement backplane links, PHY interfaces, and aggregation nodes.
- Digital signal processing — Leverage the large logic element count and embedded memory for DSP pipelines, filtering, and real-time data processing.
- Network and data-center systems — Implement packet processing, traffic management, and protocol offload functions that benefit from high aggregate data bandwidth.
- System integration and prototyping — High I/O count and programmable fabric enable board-level integration, custom bridging, and rapid hardware iteration.
Unique Advantages
- Large programmable fabric: 353,600 logic elements provide headroom for complex logic, multiple functions, or hardware acceleration blocks.
- Substantial on-chip memory: Approximately 23.1 Mbits of embedded RAM reduces external memory dependence and improves latency for buffering and stateful designs.
- High I/O density: 781 I/Os simplify system wiring and minimize the need for external multiplexing or expanders.
- Industrial operating range: −40 °C to 100 °C supports deployment in temperature-demanding environments without derating from the device specification.
- Proven device family: Features aligned with the Stratix IV Device Handbook (transceivers, DSP blocks, PLLs, clock networks) aid in predictable system design using documented architecture elements.
- Board-level integration: 1932-ball FCBGA package allows for compact, high-density PCB designs suitable for advanced electronics assemblies.
Why Choose EP4S100G4F45I1G?
The EP4S100G4F45I1G positions itself where substantial programmable resources and system-level I/O are required alongside industrial temperature capability. Its combination of 353,600 logic elements, sizable embedded memory, and the Stratix IV family feature set makes it appropriate for designers implementing high-throughput communications, DSP-heavy functions, or tightly integrated system controllers.
Documentation for the Stratix IV device family is available to guide integration and architecture decisions, providing a clear technical foundation for projects that need scalable logic, deterministic memory resources, and robust I/O connectivity.
Request a quote or submit an inquiry to obtain pricing, lead-time, and availability for EP4S100G4F45I1G.

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