EP4S100G4F45I2N

IC FPGA 781 I/O 1932FBGA
Part Description

STRATIX® IV GT Field Programmable Gate Array (FPGA) IC 781 23105536 353600 1932-BBGA, FCBGA

Quantity 960 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeIndustrialOperating Temperature0°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O781Voltage920 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs14144Number of Logic Elements/Cells353600
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits23105536

Overview of EP4S100G4F45I2N – STRATIX® IV GT Field Programmable Gate Array (FPGA) IC

The EP4S100G4F45I2N is a Stratix IV GT family FPGA offering high on-chip logic capacity and extensive I/O in a 1932-ball FCBGA package. The device provides 353,600 logic elements, approximately 23.1 Mbits of embedded RAM, and 781 I/O pins to address designs requiring large logic resources and significant external connectivity.

Designed for industrial-grade applications, the device operates from a core supply range of 920 mV to 980 mV and across an operating temperature range of 0°C to 100°C. The Stratix IV device handbook datasheet for this family documents device-level details including DC and switching characteristics, transceiver performance, PLLs, DSP block and TriMatrix memory block specifications, and configuration and JTAG information.

Key Features

  • Core / Logic Capacity  Provides 353,600 logic elements for implementing large-scale digital designs and complex logic partitions.
  • Embedded Memory  Approximately 23.1 Mbits of on-chip RAM to support buffering, look-up tables, and memory-intensive functions.
  • High I/O Count  781 I/O pins enable dense external connectivity for multi-channel interfaces and parallel data paths.
  • Package and Mounting  Supplied in a 1932-ball BGA (1932-BBGA, FCBGA) package with supplier device package listed as 1932-FBGA, FC (45×45); surface-mount device suitable for standard PCB assembly.
  • Power Supply  Core voltage specified between 920 mV and 980 mV to support the device’s internal power requirements.
  • Industrial Temperature Range  Qualified for operation from 0°C to 100°C and listed as Industrial grade.
  • Regulatory Status  RoHS-compliant construction.
  • Comprehensive Datasheet Coverage  Device handbook documentation includes electrical characteristics, power consumption, switching characteristics, transceiver performance, PLL specifications, DSP and memory block specifications, and configuration/JTAG details.

Typical Applications

  • High-density signal processing  Large logic and embedded memory enable implementation of complex DSP pipelines and multi-channel processing tasks.
  • Multi-port I/O systems  Extensive 781 I/O pins support designs that require many parallel interfaces or high pin-count connectivity.
  • Custom hardware acceleration  Significant logic element count and on-chip RAM make the device suitable for bespoke acceleration of compute-intensive algorithms.

Unique Advantages

  • Large programmable fabric  353,600 logic elements reduce the need for multiple devices when consolidating functions onto a single FPGA.
  • Substantial on-chip memory  Approximately 23.1 Mbits of embedded RAM supports data buffering and state storage without immediate external memory dependence.
  • Extensive external connectivity  781 I/O pins provide the headroom to interface with numerous peripherals, sensors, and high-channel-count systems.
  • Industrial-temperature operation  0°C to 100°C rated operation aligns the device with industrial deployment scenarios.
  • Package density for compact boards  1932-ball FCBGA package supports high-density board designs and surface-mount assembly.
  • Documented system-level features  Datasheet coverage for transceivers, PLLs, DSP blocks, and memory blocks supports informed system design and integration.

Why Choose EP4S100G4F45I2N?

The EP4S100G4F45I2N positions itself as a high-capacity Stratix IV GT FPGA for industrial designs that require a large logic fabric, significant embedded memory, and a very high I/O count in a single surface-mount BGA package. Its documented device characteristics and subsystem specifications provide the technical detail needed for integrating transceivers, PLLs, DSP functions, and memory blocks into complex hardware designs.

This device is well suited for engineering teams consolidating multiple subsystems onto one FPGA, implementing hardware acceleration, or building multi-channel I/O platforms where on-chip resources and package density help reduce board-level complexity and BOM count.

Request a quote or submit a product inquiry to check availability, lead times, and pricing for EP4S100G4F45I2N.

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