EP4S100G4F45I2N
| Part Description |
STRATIX® IV GT Field Programmable Gate Array (FPGA) IC 781 23105536 353600 1932-BBGA, FCBGA |
|---|---|
| Quantity | 960 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Industrial | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 781 | Voltage | 920 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 14144 | Number of Logic Elements/Cells | 353600 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 23105536 |
Overview of EP4S100G4F45I2N – STRATIX® IV GT Field Programmable Gate Array (FPGA) IC
The EP4S100G4F45I2N is a Stratix IV GT family FPGA offering high on-chip logic capacity and extensive I/O in a 1932-ball FCBGA package. The device provides 353,600 logic elements, approximately 23.1 Mbits of embedded RAM, and 781 I/O pins to address designs requiring large logic resources and significant external connectivity.
Designed for industrial-grade applications, the device operates from a core supply range of 920 mV to 980 mV and across an operating temperature range of 0°C to 100°C. The Stratix IV device handbook datasheet for this family documents device-level details including DC and switching characteristics, transceiver performance, PLLs, DSP block and TriMatrix memory block specifications, and configuration and JTAG information.
Key Features
- Core / Logic Capacity Provides 353,600 logic elements for implementing large-scale digital designs and complex logic partitions.
- Embedded Memory Approximately 23.1 Mbits of on-chip RAM to support buffering, look-up tables, and memory-intensive functions.
- High I/O Count 781 I/O pins enable dense external connectivity for multi-channel interfaces and parallel data paths.
- Package and Mounting Supplied in a 1932-ball BGA (1932-BBGA, FCBGA) package with supplier device package listed as 1932-FBGA, FC (45×45); surface-mount device suitable for standard PCB assembly.
- Power Supply Core voltage specified between 920 mV and 980 mV to support the device’s internal power requirements.
- Industrial Temperature Range Qualified for operation from 0°C to 100°C and listed as Industrial grade.
- Regulatory Status RoHS-compliant construction.
- Comprehensive Datasheet Coverage Device handbook documentation includes electrical characteristics, power consumption, switching characteristics, transceiver performance, PLL specifications, DSP and memory block specifications, and configuration/JTAG details.
Typical Applications
- High-density signal processing Large logic and embedded memory enable implementation of complex DSP pipelines and multi-channel processing tasks.
- Multi-port I/O systems Extensive 781 I/O pins support designs that require many parallel interfaces or high pin-count connectivity.
- Custom hardware acceleration Significant logic element count and on-chip RAM make the device suitable for bespoke acceleration of compute-intensive algorithms.
Unique Advantages
- Large programmable fabric 353,600 logic elements reduce the need for multiple devices when consolidating functions onto a single FPGA.
- Substantial on-chip memory Approximately 23.1 Mbits of embedded RAM supports data buffering and state storage without immediate external memory dependence.
- Extensive external connectivity 781 I/O pins provide the headroom to interface with numerous peripherals, sensors, and high-channel-count systems.
- Industrial-temperature operation 0°C to 100°C rated operation aligns the device with industrial deployment scenarios.
- Package density for compact boards 1932-ball FCBGA package supports high-density board designs and surface-mount assembly.
- Documented system-level features Datasheet coverage for transceivers, PLLs, DSP blocks, and memory blocks supports informed system design and integration.
Why Choose EP4S100G4F45I2N?
The EP4S100G4F45I2N positions itself as a high-capacity Stratix IV GT FPGA for industrial designs that require a large logic fabric, significant embedded memory, and a very high I/O count in a single surface-mount BGA package. Its documented device characteristics and subsystem specifications provide the technical detail needed for integrating transceivers, PLLs, DSP functions, and memory blocks into complex hardware designs.
This device is well suited for engineering teams consolidating multiple subsystems onto one FPGA, implementing hardware acceleration, or building multi-channel I/O platforms where on-chip resources and package density help reduce board-level complexity and BOM count.
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