EP4S100G2F40I3

The EP4S100G2F40I3 is a STRATIX® IV GT FPGA in a 1517-BBGA FCBGA package designed for industrial applications. It delivers a large FPGA fabric with 228,000 logic elements and series-level high-speed transceiver and architecture features described in the Stratix IV Device Handbook.

Targeted at designs requiring substantial on-chip memory, extensive I/O, and industrial temperature operation, this device is suited for systems that need high integration and deterministic operating conditions within the specified voltage and temperature ranges.

Key Features

• Logic Capacity  228,000 logic elements for implementing complex custom logic and system functions.
• Embedded Memory  Approximately 17.5 Mbits of on-chip RAM (17,544,192 total bits) for buffering, caching, and embedded data storage.
• I/O  Up to 654 I/O pins to support broad external interfacing and high-pin-count designs.
• Package & Mounting  1517-BBGA (supplier package: 1517-FBGA, 40×40) in a surface-mount form factor for high-density PCB integration.
• Power Supply  Core voltage specified from 920 mV to 980 mV to match system power-rail design requirements.
• Operating Range  Industrial temperature rating: −40 °C to 100 °C for deployment in environments requiring extended temperature tolerance.
• Series-Level Architecture  Part of the Stratix IV GT family; series documentation highlights architecture features such as high-speed transceiver capability, DSP blocks, PLLs, clock networks, and external memory interface support.
• Compliance  RoHS compliant for environmental and regulatory alignment.

Typical Applications

• High‑speed communications  Leverages the Stratix IV GT series transceiver and I/O density to implement protocol bridging, switching logic, and packet processing functions.
• Signal processing and DSP  On-chip RAM and the Stratix IV family DSP-oriented architecture support real-time data manipulation and algorithm acceleration.
• External memory interfaces  Suitable for designs that require tight integration with off-chip memory controllers using the device’s architecture and I/O resources.
• Industrial control and automation  Industrial temperature rating and robust I/O count make the device appropriate for advanced control logic, I/O aggregation, and sensor interfacing in industrial systems.

Unique Advantages

• High logic density: 228,000 logic elements provide headroom for complex custom architectures and accelerated functions within a single device.
• Substantial embedded memory: Approximately 17.5 Mbits of on-chip RAM reduces dependence on external memory for many buffering and caching tasks.
• Extensive I/O connectivity: 654 I/Os enable flexible external interfacing and high-pin-count system topologies without additional bridge devices.
• Industrial-grade operation: Specified −40 °C to 100 °C operation supports deployment in temperature-challenging environments.
• Compact, surface-mount package: 1517-BBGA (1517-FBGA, 40×40) balances density and board-level integration for space-constrained designs.
• Documented family capabilities: Stratix IV Device Handbook references for series-level transceiver, clocking, DSP, and interface features aid system architects during design and verification.

Why Choose EP4S100G2F40I3?

The EP4S100G2F40I3 positions itself as a high-capacity, industrial-temperature Stratix IV GT FPGA suitable for designs that demand substantial on-chip logic, memory, and I/O resources. Its package, power, and temperature specifications make it a practical option for embedded systems, communications equipment, and industrial control applications that require a deterministic hardware platform.

Designed within the Stratix IV GT device family and supported by the Stratix IV Device Handbook, this part provides designers with the documented architecture and series-level feature set needed to plan integration, clocking, transceiver usage, and memory interfaces while adhering to RoHS requirements.

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