EP4S100G2F40I1N
| Part Description |
STRATIX® IV GT Field Programmable Gate Array (FPGA) IC 654 17544192 228000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 388 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Industrial | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 654 | Voltage | 920 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 9120 | Number of Logic Elements/Cells | 228000 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 17544192 |
Overview of EP4S100G2F40I1N – STRATIX® IV GT FPGA, 228,000 Logic Elements, 1517-FBGA
The EP4S100G2F40I1N is a STRATIX® IV GT Field Programmable Gate Array (FPGA) from Intel presented in a 1517-BBGA / 1517-FBGA (40×40) package. It delivers high digital integration with 228,000 logic elements and approximately 17.5 Mbits of embedded memory for designs that require significant programmable logic and on-chip storage. With 654 I/O pins and an industrial-grade operating range, it is targeted at systems that need substantial I/O density and on-chip resources in a surface-mount FCBGA package.
Key Features
- Logic Capacity — 228,000 logic elements provide substantial programmable logic resources for complex digital designs.
- Embedded Memory — Approximately 17.5 Mbits of on-chip RAM to support data buffering, state storage, and local memory needs.
- I/O Density — 654 general-purpose I/O pins to accommodate wide interface requirements and multiple peripheral connections.
- Power Supply — Core voltage specified from 920 mV to 980 mV for the device core.
- Package and Mounting — Supplied in a 1517-BBGA, FCBGA package; supplier device package listed as 1517-FBGA (40×40). Surface-mount mounting type simplifies PCB assembly for high-density boards.
- Operating Environment — Industrial grade with an operating temperature range of 0 °C to 100 °C.
- Regulatory — RoHS compliant.
Unique Advantages
- High logic integration: 228,000 logic elements enable consolidation of multiple functions into a single device, reducing board-level BOM and interconnect complexity.
- Significant on-chip memory: Approximately 17.5 Mbits of embedded RAM supports local buffering and state machines without relying on external memory.
- Extensive I/O capability: 654 I/O pins allow flexible interfacing to sensors, transceivers, and legacy buses, helping designers support dense connectivity.
- Compact FCBGA packaging: The 1517-FBGA (40×40) package offers a compact, high-pin-count solution suitable for space-constrained PCBs.
- Industrial temperature grade: Rated for 0 °C to 100 °C operation to meet deployment needs in controlled industrial environments.
- Low-voltage core operation: Core supply specified between 0.92 V and 0.98 V, consistent with modern FPGA core voltage requirements.
Why Choose EP4S100G2F40I1N?
The EP4S100G2F40I1N positions itself as a high-density, industrial-grade FPGA solution that balances large programmable logic capacity, substantial embedded memory, and broad I/O in a compact FCBGA package. Its specification set is suited for engineers requiring significant on-chip resources and high I/O count while maintaining a surface-mount assembly flow.
This part is appropriate for design teams focused on systems needing consolidation of logic functions, local data storage, and flexible interfacing, and for procurements that prioritize RoHS-compliant, industrial-grade components with defined voltage and temperature operating windows.
Request a quote or submit an inquiry for pricing and availability of EP4S100G2F40I1N to receive lead-time and purchasing information tailored to your project requirements.

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