EP4S100G2F40I1N

IC FPGA 654 I/O 1517FBGA
Part Description

STRATIX® IV GT Field Programmable Gate Array (FPGA) IC 654 17544192 228000 1517-BBGA, FCBGA

Quantity 388 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature0°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O654Voltage920 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs9120Number of Logic Elements/Cells228000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits17544192

Overview of EP4S100G2F40I1N – STRATIX® IV GT FPGA, 228,000 Logic Elements, 1517-FBGA

The EP4S100G2F40I1N is a STRATIX® IV GT Field Programmable Gate Array (FPGA) from Intel presented in a 1517-BBGA / 1517-FBGA (40×40) package. It delivers high digital integration with 228,000 logic elements and approximately 17.5 Mbits of embedded memory for designs that require significant programmable logic and on-chip storage. With 654 I/O pins and an industrial-grade operating range, it is targeted at systems that need substantial I/O density and on-chip resources in a surface-mount FCBGA package.

Key Features

  • Logic Capacity — 228,000 logic elements provide substantial programmable logic resources for complex digital designs.
  • Embedded Memory — Approximately 17.5 Mbits of on-chip RAM to support data buffering, state storage, and local memory needs.
  • I/O Density — 654 general-purpose I/O pins to accommodate wide interface requirements and multiple peripheral connections.
  • Power Supply — Core voltage specified from 920 mV to 980 mV for the device core.
  • Package and Mounting — Supplied in a 1517-BBGA, FCBGA package; supplier device package listed as 1517-FBGA (40×40). Surface-mount mounting type simplifies PCB assembly for high-density boards.
  • Operating Environment — Industrial grade with an operating temperature range of 0 °C to 100 °C.
  • Regulatory — RoHS compliant.

Unique Advantages

  • High logic integration: 228,000 logic elements enable consolidation of multiple functions into a single device, reducing board-level BOM and interconnect complexity.
  • Significant on-chip memory: Approximately 17.5 Mbits of embedded RAM supports local buffering and state machines without relying on external memory.
  • Extensive I/O capability: 654 I/O pins allow flexible interfacing to sensors, transceivers, and legacy buses, helping designers support dense connectivity.
  • Compact FCBGA packaging: The 1517-FBGA (40×40) package offers a compact, high-pin-count solution suitable for space-constrained PCBs.
  • Industrial temperature grade: Rated for 0 °C to 100 °C operation to meet deployment needs in controlled industrial environments.
  • Low-voltage core operation: Core supply specified between 0.92 V and 0.98 V, consistent with modern FPGA core voltage requirements.

Why Choose EP4S100G2F40I1N?

The EP4S100G2F40I1N positions itself as a high-density, industrial-grade FPGA solution that balances large programmable logic capacity, substantial embedded memory, and broad I/O in a compact FCBGA package. Its specification set is suited for engineers requiring significant on-chip resources and high I/O count while maintaining a surface-mount assembly flow.

This part is appropriate for design teams focused on systems needing consolidation of logic functions, local data storage, and flexible interfacing, and for procurements that prioritize RoHS-compliant, industrial-grade components with defined voltage and temperature operating windows.

Request a quote or submit an inquiry for pricing and availability of EP4S100G2F40I1N to receive lead-time and purchasing information tailored to your project requirements.

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