EP4CGX75DF27I7

The EP4CGX75DF27I7 is an Intel Cyclone® IV GX field programmable gate array (FPGA) in a 672-ball BGA package. It provides a large programmable fabric paired with on-chip memory and a high pin count, designed for industrial applications that require substantial logic capacity and flexible I/O.

Key value propositions include a sizable logic element count, embedded RAM capacity, a broad I/O complement, and an industrial operating temperature range—together supporting complex, reliable designs in demanding environments.

Key Features

• Core Logic  Provides 73,920 logic elements to implement complex custom logic, state machines, and data-path functions.
• Embedded Memory  Approximately 4.26 Mbits of on-chip RAM to support buffering, lookup tables, and local storage for high-throughput designs.
• I/O Capacity  310 user I/Os enable dense external connectivity for sensors, peripherals, and system interfaces.
• Power  Specified core voltage supply range of 1.16 V to 1.24 V for device power planning and regulator selection.
• Package & Mounting  672-ball BGA (supplier package: 672-FBGA, 27×27) in a surface-mount form factor for high-density board layouts.
• Temperature & Grade  Industrial-grade device rated for operation from −40 °C to 100 °C for use in temperature-challenging environments.
• Compliance  RoHS compliant to support regulatory and environmental requirements.

Typical Applications

• Industrial Automation  Programmable logic and embedded memory combined with an industrial temperature range make this FPGA suitable for control, monitoring, and processing tasks on factory and process automation platforms.
• High-Density I/O Systems  With 310 I/Os and a compact 672-BGA footprint, the device supports designs requiring numerous external connections in limited PCB area.
• Embedded Data Processing  Large logic capacity and approximately 4.26 Mbits of on-chip RAM enable implementation of custom data paths, preprocessing, and real-time processing functions.
• Communications and Networking Modules  The combination of logic resources and I/O count is suitable for custom protocol handling, packet processing, and interface bridging in networked equipment.

Unique Advantages

• Substantial programmable fabric: 73,920 logic elements provide the capacity to consolidate multiple functions into a single device, reducing overall system complexity.
• On-chip memory resources: Approximately 4.26 Mbits of embedded RAM minimize external memory dependency for buffering and temporary storage.
• High I/O density: 310 I/Os allow flexible interfacing to a wide range of peripherals and external chips without multiple I/O expanders.
• Industrial robustness: Rated for −40 °C to 100 °C operation and specified as industrial grade for deployment in harsher environments.
• Compact, board-friendly package: 672-FBGA (27×27) surface-mount package supports high-density PCB designs while maintaining robust electrical connections.
• RoHS compliance: Meets environmental lead-free requirements for broader manufacturing acceptance.

Why Choose EP4CGX75DF27I7?

The EP4CGX75DF27I7 delivers a combination of large logic capacity, meaningful on-chip memory, and a high I/O count in a compact industrial-grade BGA package. This balance supports systems that require significant custom logic, local data storage, and extensive external connectivity while operating across a wide temperature range.

It is well suited to engineers and teams building industrial automation, communications modules, and embedded processing platforms that need a scalable, reliable FPGA platform backed by Intel's Cyclone IV GX architecture.

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