EP4CGX75DF27C8

The EP4CGX75DF27C8 is a Cyclone® IV GX field programmable gate array (FPGA) from Intel, provided in a 672-ball BGA package for surface-mount applications. It integrates 73,920 logic elements and approximately 4.26 Mbits of embedded memory, with 310 user I/Os, targeting commercial-grade designs that require flexible programmable logic and on-chip memory.

Designed for systems operating within a 1.16 V to 1.24 V supply range and a 0 °C to 85 °C temperature window, this device is RoHS compliant and supplied in a 672-FBGA (27×27) package footprint.

Key Features

• Logic Capacity — 73,920 logic elements provide substantial programmable fabric for custom digital logic, state machines, and parallel processing implementations.
• Embedded Memory — Approximately 4.26 Mbits of on-chip RAM to support buffering, lookup tables, and local data storage within the FPGA fabric.
• I/O Density — 310 user I/Os to interface with external peripherals, sensors, and daughterboards while supporting diverse board-level connectivity.
• Power Requirements — Operates from a defined core supply range of 1.16 V to 1.24 V, allowing predictable power budgeting in system design.
• Package and Mounting — Available in a 672-BGA package (supplier package: 672-FBGA (27×27)) for surface-mount assembly, supporting compact board layouts.
• Commercial Grade — Specified for commercial operating conditions with an ambient temperature range of 0 °C to 85 °C.
• Regulatory Compliance — RoHS compliant for materials and manufacturing processes.

Typical Applications

• Custom Logic and Acceleration — Implement hardware-accelerated functions and custom datapaths using the device's large logic element count and on-chip memory.
• Prototyping and Development — Use as a flexible platform for validating digital designs and performing hardware/software co-design with plentiful I/O and logic resources.
• System Integration — Integrate glue logic, protocol bridging, and interface handling where dense I/O and programmable logic are required.

Unique Advantages

• High Logic Density: 73,920 logic elements enable complex designs without immediate need for external programmable logic expansion.
• On-Chip Memory: Approximately 4.26 Mbits of embedded RAM reduces dependence on external memory for intermediate buffering and state storage.
• Generous I/O Count: 310 I/Os simplify board-level connectivity and reduce the need for additional interface components.
• Compact BGA Footprint: The 672-BGA (672-FBGA (27×27)) package supports high-density PCB designs while maintaining surface-mount assembly compatibility.
• Predictable Power Envelope: A defined core voltage range (1.16 V–1.24 V) helps streamline power supply design and verification.
• RoHS Compliant: Conforms to RoHS material restrictions for regulatory and environmental considerations.

Why Choose EP4CGX75DF27C8?

The EP4CGX75DF27C8 positions itself as a commercially graded Cyclone IV GX FPGA option for designers who need substantial programmable logic, embedded RAM, and a high I/O count in a compact BGA package. Its electrical and thermal specifications support predictable integration into commercial systems where surface-mount assembly and RoHS compliance are required.

This part is suitable for teams building custom logic, prototyping hardware-accelerated functions, or consolidating multiple discrete functions into a single programmable device while relying on Intel's published documentation for implementation details.

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