EP4CGX75DF27I7N

The EP4CGX75DF27I7N is an Intel Cyclone® IV GX FPGA offering high-density programmable logic in a compact 672-ball BGA package. It provides a combination of logic resources, on-chip memory, and a substantial I/O count designed for demanding industrial-temperature applications.

With 73,920 logic elements, approximately 4.26 Mbits of embedded memory, 310 user I/Os, and an industrial operating range from −40 °C to 100 °C, this device addresses designs requiring significant integration, deterministic I/O connectivity, and a controlled voltage supply range of 1.16 V to 1.24 V.

Key Features

• Programmable Logic Capacity — 73,920 logic elements delivering substantial resource density for complex digital designs.
• Embedded Memory — Approximately 4.26 Mbits of on-chip RAM (4,257,792 bits) for buffering, lookup tables, and state storage.
• I/O Resources — 310 user I/O pins to support parallel interfaces, external memories, and peripheral connectivity.
• Power and Voltage — Operates from a defined core supply voltage range of 1.16 V to 1.24 V for predictable power domain planning.
• Package and Mounting — 672-ball BGA (672-FBGA, 27 × 27) in a surface-mount form factor for board-level integration.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C to meet elevated environmental requirements.
• RoHS Compliant — Conforms to RoHS standards for lead-free manufacturing compliance.

Typical Applications

• Industrial Control — Hardware platforms that require industrial temperature operation and a large I/O count to interface with sensors, actuators, and control networks.
• High-Density Logic Implementations — Designs that need tens of thousands of logic elements and significant embedded memory for signal processing, protocol implementation, or state machines.
• Embedded System Integration — Compact board designs leveraging the 672-BGA package and broad I/O to integrate peripherals and external memories.

Unique Advantages

• High logic density: 73,920 logic elements provide room for complex logic implementations without adding multiple devices.
• Substantial on-chip RAM: Approximately 4.26 Mbits of embedded memory supports buffering and local data storage to simplify external memory needs.
• Extensive I/O availability: 310 I/Os enable flexible interfacing to a wide set of peripherals and system buses.
• Industrial-grade operation: −40 °C to 100 °C temperature rating supports deployment in temperature-challenging environments.
• Compact package: 672-FBGA (27 × 27) surface-mount package balances density with board-level integration requirements.
• Controlled core voltage: Defined 1.16 V to 1.24 V supply range simplifies power-supply design and validation.

Why Choose EP4CGX75DF27I7N?

The EP4CGX75DF27I7N positions itself as a high-density Cyclone IV GX FPGA option for designs that need a large amount of programmable logic, embedded memory, and a high I/O count within a compact BGA footprint. Its industrial temperature rating and defined supply range make it suitable for systems that require robustness across a wide thermal range.

This device is appropriate for development teams and procurement groups targeting scalable, integrated FPGA solutions from a recognized manufacturer, delivering a balance of logic capacity, embedded memory, and board-level I/O connectivity for medium- to high-complexity designs.

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