EP4CGX75DF27C7N
| Part Description |
Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 310 4257792 73920 672-BGA |
|---|---|
| Quantity | 235 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BGA | Number of I/O | 310 | Voltage | 1.16 V - 1.24 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4620 | Number of Logic Elements/Cells | 73920 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4257792 |
Overview of EP4CGX75DF27C7N – Cyclone® IV GX FPGA, 672‑BGA
The EP4CGX75DF27C7N is a Cyclone® IV GX Field Programmable Gate Array (FPGA) IC from Intel, provided in a 672-ball BGA package. It delivers a high-density logic fabric and embedded memory suitable for commercial-grade digital designs.
Key on-chip resources include 73,920 logic elements, approximately 4.26 Mbits of embedded RAM, and up to 310 I/O pins, making this device appropriate for applications that require substantial logic capacity and flexible I/O in a surface-mount BGA form factor.
Key Features
- Logic Capacity — 73,920 logic elements provide extensive programmable logic for complex digital designs; device data also lists 4,620 logic array blocks (LABs).
- Embedded Memory — Approximately 4.26 Mbits of on-chip RAM (4,257,792 total RAM bits) for data buffering, FIFOs, and state storage without external memory.
- I/O Density — Up to 310 I/O pins support broad interface and peripheral connectivity options within a single device.
- Power Supply — Operates from a core voltage supply range of 1.16 V to 1.24 V, enabling precise core power budgeting.
- Package & Mounting — 672-ball BGA (supplier package: 672-FBGA, 27×27) in a surface-mount form factor for compact PCB integration.
- Operating Range & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
- Environmental Compliance — RoHS compliant.
Unique Advantages
- High-density programmable logic: 73,920 logic elements enable implementation of large-scale digital functions on a single device, reducing system complexity.
- Substantial on-chip memory: Approximately 4.26 Mbits of embedded RAM reduces reliance on external memory for buffering and temporary storage.
- Generous I/O count: 310 I/O pins allow direct interfacing to numerous peripherals and interfaces without additional bridging devices.
- Compact BGA footprint: 672-ball BGA (27×27 supplier package) supports high-density board designs and surface-mount assembly workflows.
- Commercial-grade reliability: Specified 0 °C to 85 °C operating range and RoHS compliance support mainstream commercial deployments.
- Predictable core power requirements: Narrow voltage supply range (1.16 V–1.24 V) simplifies power supply design and regulation planning.
Why Choose EP4CGX75DF27C7N?
The EP4CGX75DF27C7N positions itself as a commercially graded Cyclone® IV GX FPGA offering a balance of high logic capacity, embedded memory, and extensive I/O in a compact 672-BGA package. Its resource mix is suited to teams and designs that need to consolidate logic, memory, and interfaces into a single programmable device while maintaining predictable power and thermal considerations.
This device is a practical option for engineers and procurement looking for a high-density, RoHS-compliant FPGA with clear, verifiable specifications for logic elements, on-chip RAM, I/O count, package, and operating conditions. It supports scalable design choices within commercial-temperature environments and surface-mount assembly processes.
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