EP4CGX75DF27C7N

IC FPGA 310 I/O 672FBGA
Part Description

Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 310 4257792 73920 672-BGA

Quantity 235 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BGANumber of I/O310Voltage1.16 V - 1.24 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4620Number of Logic Elements/Cells73920
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4257792

Overview of EP4CGX75DF27C7N – Cyclone® IV GX FPGA, 672‑BGA

The EP4CGX75DF27C7N is a Cyclone® IV GX Field Programmable Gate Array (FPGA) IC from Intel, provided in a 672-ball BGA package. It delivers a high-density logic fabric and embedded memory suitable for commercial-grade digital designs.

Key on-chip resources include 73,920 logic elements, approximately 4.26 Mbits of embedded RAM, and up to 310 I/O pins, making this device appropriate for applications that require substantial logic capacity and flexible I/O in a surface-mount BGA form factor.

Key Features

  • Logic Capacity — 73,920 logic elements provide extensive programmable logic for complex digital designs; device data also lists 4,620 logic array blocks (LABs).
  • Embedded Memory — Approximately 4.26 Mbits of on-chip RAM (4,257,792 total RAM bits) for data buffering, FIFOs, and state storage without external memory.
  • I/O Density — Up to 310 I/O pins support broad interface and peripheral connectivity options within a single device.
  • Power Supply — Operates from a core voltage supply range of 1.16 V to 1.24 V, enabling precise core power budgeting.
  • Package & Mounting — 672-ball BGA (supplier package: 672-FBGA, 27×27) in a surface-mount form factor for compact PCB integration.
  • Operating Range & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Environmental Compliance — RoHS compliant.

Unique Advantages

  • High-density programmable logic: 73,920 logic elements enable implementation of large-scale digital functions on a single device, reducing system complexity.
  • Substantial on-chip memory: Approximately 4.26 Mbits of embedded RAM reduces reliance on external memory for buffering and temporary storage.
  • Generous I/O count: 310 I/O pins allow direct interfacing to numerous peripherals and interfaces without additional bridging devices.
  • Compact BGA footprint: 672-ball BGA (27×27 supplier package) supports high-density board designs and surface-mount assembly workflows.
  • Commercial-grade reliability: Specified 0 °C to 85 °C operating range and RoHS compliance support mainstream commercial deployments.
  • Predictable core power requirements: Narrow voltage supply range (1.16 V–1.24 V) simplifies power supply design and regulation planning.

Why Choose EP4CGX75DF27C7N?

The EP4CGX75DF27C7N positions itself as a commercially graded Cyclone® IV GX FPGA offering a balance of high logic capacity, embedded memory, and extensive I/O in a compact 672-BGA package. Its resource mix is suited to teams and designs that need to consolidate logic, memory, and interfaces into a single programmable device while maintaining predictable power and thermal considerations.

This device is a practical option for engineers and procurement looking for a high-density, RoHS-compliant FPGA with clear, verifiable specifications for logic elements, on-chip RAM, I/O count, package, and operating conditions. It supports scalable design choices within commercial-temperature environments and surface-mount assembly processes.

Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for EP4CGX75DF27C7N.

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