EP4CGX75CF23I7N

The EP4CGX75CF23I7N is an Intel Cyclone® IV GX field programmable gate array (FPGA) supplied in a 484-ball BGA package. It delivers a high logic capacity and substantial embedded RAM in a surface-mount package designed for industrial-grade environments.

With 73,920 logic elements, approximately 4.26 Mbits of on-chip RAM and 290 general-purpose I/O, this device targets designs that require high-density programmable logic, significant memory resources, and broad I/O connectivity while operating over an industrial temperature range.

Key Features

• Logic Capacity — 73,920 logic elements to implement complex custom logic and datapath functions within a single device.
• Embedded Memory — Approximately 4.26 Mbits of on-chip RAM to support buffering, FIFOs, and local storage requirements.
• I/O Count — 290 user I/O pins to accommodate wide peripheral interfacing and parallel connectivity.
• Package — 484-ball BGA (supplier package: 484-FBGA, 23×23) in a surface-mount form factor for board-level density and reliable solder attachment.
• Power — Core supply voltage range from 1.16 V to 1.24 V for defined low-voltage operation.
• Industrial Temperature Range — Rated to operate from −40 °C to 100 °C to meet industrial environmental requirements.
• Compliance — RoHS compliant.

Typical Applications

• Industrial Automation — Industrial-grade temperature and robust I/O count support programmable logic tasks in factory and process-control equipment.
• Embedded Systems — High logic and memory capacity enable implementation of custom controllers, protocol bridges, and hardware accelerators.
• Communication Interfaces — Large I/O complement and on-chip memory facilitate protocol handling and buffering for interface subsystems.

Unique Advantages

• High Logic Density: 73,920 logic elements allow consolidation of multiple functions into a single FPGA, reducing board-level BOM and interconnect complexity.
• Substantial On-Chip Memory: Approximately 4.26 Mbits of embedded RAM supports packet buffering, data FIFOs, and local storage without external memory.
• Extensive I/O: 290 I/O pins give flexibility for parallel interfaces, wide buses, and multiple peripheral connections.
• Industrial-Rated Operation: −40 °C to 100 °C operating range enables deployment in demanding environments where temperature resilience is required.
• Compact BGA Packaging: 484-ball 23×23 FBGA provides high interconnect density while maintaining a surface-mount footprint suited for modern PCB layouts.
• Defined Low-Voltage Core: 1.16 V to 1.24 V supply range offers predictable power design for core rails.

Why Choose EP4CGX75CF23I7N?

The EP4CGX75CF23I7N positions itself as a high-capacity, industrial-grade Cyclone® IV GX FPGA that balances logic density, embedded memory, and extensive I/O in a 484-BGA package. It is well suited to engineering teams needing a single-device solution for complex logic, buffering, and multiple peripheral interfaces within industrial temperature constraints.

Backed by Intel as the manufacturer and RoHS compliant, this device offers a stable platform for designs that require long-term availability, robust operating range, and integration of sizable programmable logic and memory resources.

If you would like pricing, availability, or a formal quote for EP4CGX75CF23I7N, please request a quote or contact sales to submit your requirements and receive assistance.