EP4CGX75CF23I7

The EP4CGX75CF23I7 is a Cyclone® IV GX field programmable gate array (FPGA) IC from Intel packaged in a 484‑BGA. It provides a high count of on‑chip logic resources and embedded memory in an industrial‑grade, surface‑mount package.

With 73,920 logic elements, approximately 4.26 Mbits of embedded memory and 290 I/O pins, this device is suited to designs that require substantial on‑chip resources and robust temperature range support.

Key Features

• Core Logic 73,920 logic elements provide a large fabric for implementing complex digital functions and custom hardware acceleration.
• Embedded Memory Approximately 4.26 Mbits of on‑chip RAM for data buffering, state storage, and local memory requirements.
• I/O Capacity 290 I/O pins support extensive external connectivity for sensors, peripherals, and bus interfaces.
• Power Nominal supply range from 1.16 V to 1.24 V to match system power rails and design requirements.
• Package & Mounting 484‑BGA / 484‑FBGA (23×23) package optimized for surface‑mount assembly and dense PCB designs.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C to meet industrial environment temperature demands.
• Compliance RoHS compliant for environmental regulatory alignment.

Typical Applications

• Industrial Control High logic density and industrial temperature rating support control systems, PLCs and motor control interfaces requiring reliable operation over wide temperatures.
• Data Acquisition & Processing Large embedded memory and many I/Os allow local buffering and processing of sensor data and multi‑channel inputs.
• Communications Infrastructure Extensive I/O and on‑chip resources enable protocol handling and custom packet processing in networking equipment.

Unique Advantages

• High On‑Chip Integration: 73,920 logic elements and approximately 4.26 Mbits of embedded memory reduce dependence on external logic and memory components.
• Broad I/O Count: 290 I/Os accommodate complex interconnect requirements without additional multiplexing hardware.
• Industrial‑Grade Operation: Rated from −40 °C to 100 °C for deployment in demanding temperature environments.
• Compact, Surface‑Mount Package: 484‑BGA (484‑FBGA, 23×23) supports dense PCB layouts while enabling automated assembly.
• Regulatory Readiness: RoHS compliance simplifies environmental compliance for product manufacturing.

Why Choose EP4CGX75CF23I7?

The EP4CGX75CF23I7 positions itself as a robust FPGA option for designs that need substantial on‑chip logic, memory and I/O resources in an industrial‑rated device. Its combination of 73,920 logic elements, approximately 4.26 Mbits of embedded memory and a 290‑pin I/O complement supports complex, connected designs while the 484‑BGA package enables compact board implementations.

This device is suitable for engineering teams and procurement seeking an Intel Cyclone IV GX FPGA with industrial temperature capability, RoHS compliance, and a package compatible with surface‑mount production processes.

Request a quote or submit a sales inquiry for EP4CGX75CF23I7 to discuss availability, pricing and lead time for your project needs.