EP4CGX75CF23C8

The EP4CGX75CF23C8 is a Cyclone® IV GX FPGA from Intel, offering a high-capacity, programmable logic resource in a compact 484-BGA package. It provides designers with up to 73,920 logic elements, approximately 4.26 Mbits of embedded memory, and 290 I/Os for dense, configurable digital designs.

Designed for commercial-grade applications, this device supports a supply voltage range of 1.16 V to 1.24 V, surface-mount PCB assembly, and operation across a 0 °C to 85 °C temperature range, with RoHS compliance for environmental compatibility.

Key Features

• Programmable Logic Capacity  Up to 73,920 logic elements to implement complex digital functions and custom logic architectures.
• Embedded Memory  Approximately 4.26 Mbits of on-chip RAM to support data buffering, FIFOs, and on‑chip storage.
• I/O Capability  290 general-purpose I/Os to interface with peripherals, sensors, and external devices requiring substantial connectivity.
• Package and Mounting  484-BGA (supplier package: 484-FBGA 23×23) in a surface-mount form factor for compact board layouts.
• Power  Narrow core supply range of 1.16 V to 1.24 V for predictable power budgeting and supply design.
• Commercial Temperature Range  Rated for operation from 0 °C to 85 °C, suitable for a wide range of commercial environments.
• Regulatory Compliance  RoHS-compliant construction to meet common environmental and manufacturing requirements.

Typical Applications

• Custom digital logic and prototyping  Implement and iterate complex, high-density digital designs using the device's large logic-element count and embedded memory.
• High‑density I/O interfacing  Support boards and modules that require many external connections with the 290 available I/O pins.
• On-chip buffering and data handling  Utilize approximately 4.26 Mbits of embedded RAM for local buffering, packet staging, or temporary data storage.

Unique Advantages

• Substantial logic resources: 73,920 logic elements enable implementation of large-scale combinational and sequential logic without immediate need for external ASICs.
• Integrated memory capacity: Approximately 4.26 Mbits of on-chip RAM reduces dependence on external memory for many buffering and storage tasks.
• Generous I/O count: 290 I/Os simplify board-level integration by reducing the need for external I/O expanders or multiplexing.
• Compact BGA package: 484-FBGA (23×23) balances high pin count with a small PCB footprint for space-constrained systems.
• Commercial-grade operation: 0 °C to 85 °C rating and RoHS compliance make the device suitable for mainstream commercial deployments.

Why Choose EP4CGX75CF23C8?

The EP4CGX75CF23C8 delivers a balanced combination of high logic density, embedded memory, and extensive I/O in a compact 484-BGA package. Its defined supply range and commercial temperature rating make it a straightforward choice for engineers building complex, programmable digital subsystems within commercial product constraints.

This FPGA is well suited to design teams and procurement groups seeking a configurable hardware platform that consolidates logic, memory, and I/O into a single device—helping to reduce component count and streamline PCB layout while maintaining predictable electrical and thermal parameters.

Request a quote or submit an inquiry to learn about availability and pricing for EP4CGX75CF23C8. Our team can provide purchasing and delivery information to support your design schedule.