EP4CGX75CF23C6

The EP4CGX75CF23C6 is a Cyclone® IV GX field programmable gate array (FPGA) from Intel, provided in a 484-ball fine-pitch BGA package. It delivers a mid-range programmable-logic resource set intended for commercial embedded designs that require substantial logic capacity, on-chip memory, and flexible I/O in a compact surface-mount package.

Key Features

• Programmable Logic  Provides 73,920 logic elements for implementing custom digital logic and state machines.
• Embedded Memory  Approximately 4.26 Mbits of on-chip RAM to store buffers, FIFOs, and state data without external memory.
• I/O Capacity  Up to 290 I/O pins to support a wide range of peripheral interfaces and board-level signals.
• Core Supply Voltage  Operates with a core voltage supply range of 1.16 V to 1.24 V, enabling predictable power planning for the FPGA core.
• Package and Mounting  Supplied in a 484-FBGA (23×23) package, designed for surface-mount assembly in space-constrained designs.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C, suitable for commercial electronic applications.
• Environmental Compliance  RoHS compliant for designs that require lead-free, compliant components.

Typical Applications

• Commercial Embedded Systems  Implement custom control logic, protocol handling, and data path functions in compact commercial products.
• Prototyping and Development  Provide a reprogrammable platform for validating digital designs and iterating hardware-accelerated functions.
• I/O-Intensive Control  Support designs that require many external signals or parallel interfaces thanks to 290 available I/Os.

Unique Advantages

• High Logic Capacity: 73,920 logic elements enable complex logic implementations without immediate need for larger devices.
• Significant On-Chip Memory: Approximately 4.26 Mbits of embedded RAM reduces dependence on external memory for buffering and state storage.
• Generous I/O Count: 290 I/Os give design flexibility for multiple peripherals and parallel interfaces on a single device.
• Compact BGA Footprint: 484-FBGA (23×23) package allows high-density placement for space-constrained PCBs while supporting surface-mount assembly.
• Commercial Temperature Rating: 0 °C to 85 °C operation aligns with commercial product deployments where standard temperature ranges apply.
• RoHS Compliant: Meets environmental requirements for lead-free assemblies and regulatory compliance.

Why Choose EP4CGX75CF23C6?

The EP4CGX75CF23C6 positions itself as a commercially graded, mid-range Cyclone IV GX FPGA that combines substantial logic resources, embedded memory, and a high I/O count in a compact 484-BGA package. Its specified core voltage range and commercial temperature rating make it suitable for a wide range of commercial embedded designs where integration and board-level density are priorities.

Manufactured by Intel, this device is well-suited for engineers and procurement teams looking for a programmable-logic device that balances logic capacity, on-chip RAM, and I/O flexibility while meeting RoHS requirements.

Request a quote today to receive pricing and availability information for the EP4CGX75CF23C6 and to discuss how it fits your next commercial FPGA design.