EP4CGX50DF27C8

The EP4CGX50DF27C8 is a Cyclone® IV GX field programmable gate array (FPGA) supplied in a 672‑ball BGA package. It delivers 49,888 logic elements, approximately 2.56 Mbits of on‑chip RAM, and 310 I/O pins in a surface‑mount form factor targeted for commercial electronic designs.

Key device attributes include a core supply range of 1.16 V to 1.24 V, a commercial operating temperature range of 0 °C to 85 °C, and RoHS compliance.

Key Features

• Core Logic 49,888 logic elements for implementing complex programmable digital logic.
• Embedded Memory Approximately 2.56 Mbits of on‑chip RAM to support data buffering, state machines, and intermediate storage.
• I/O Capability 310 user I/O pins suitable for moderate to high I/O count designs and multiple interface connections.
• Power Core voltage supply range of 1.16 V to 1.24 V to match system power-rail requirements.
• Package & Mounting 672‑ball BGA (supplier package: 672‑FBGA, 27×27) in a surface‑mount configuration for compact board integration.
• Temperature & Grade Commercial grade device rated for 0 °C to 85 °C operation.
• Environmental Compliance RoHS compliant to support environmentally conscious manufacturing processes.

Typical Applications

• Custom Logic Acceleration Implement application‑specific digital functions using the device’s 49,888 logic elements and embedded RAM.
• I/O‑Intensive Interface Control Manage multiple external interfaces and signals with 310 available I/O pins.
• Embedded System Integration Use the Cyclone IV GX device in commercial electronic systems that require programmable logic, on‑chip memory, and a compact BGA package.

Unique Advantages

• Substantial Logic Capacity: 49,888 logic elements enable complex finite state machines, datapaths, and control logic without external PLD components.
• On‑Chip Memory: Approximately 2.56 Mbits of embedded RAM reduces dependency on external memory for many buffering and temporary storage needs.
• High I/O Count: 310 I/Os allow for flexible interfacing and support for multiple peripheral connections on a single device.
• Compact, Surface‑Mount Packaging: 672‑BGA (672‑FBGA, 27×27) provides a high pin‑count solution in a compact footprint suitable for PCB space‑constrained designs.
• Designed for Commercial Electronics: Commercial temperature rating (0 °C to 85 °C) and RoHS compliance align with standard commercial product requirements.

Why Choose EP4CGX50DF27C8?

EP4CGX50DF27C8 is positioned for commercial electronic designs that require a programmable logic device with substantial logic resources, embedded memory, and a high I/O count delivered in a compact BGA package. Its defined core voltage range and commercial temperature rating make it suitable for a wide range of standard electronic products.

The combination of 49,888 logic elements, approximately 2.56 Mbits of on‑chip RAM, 310 I/Os, and a 672‑ball BGA package provides a balance of integration and board‑level flexibility for engineers specifying programmable logic into their designs.

Request a quote or submit a procurement inquiry today to evaluate EP4CGX50DF27C8 for your next commercial FPGA implementation.