EP4CGX50DF27C6N

The EP4CGX50DF27C6N is a Cyclone® IV GX field programmable gate array (FPGA) from Intel, supplied in a 672‑BGA package. It delivers a high-density programmable logic resource set with on‑chip memory and a substantial I/O count suitable for compact, surface‑mount board designs.

Targeted at commercial‑grade applications, this device balances logic capacity, embedded RAM, and a broad I/O footprint while operating within a 1.16 V–1.24 V supply window and a 0 °C–85 °C temperature range.

Key Features

• Logic Capacity — Provides 49,888 logic elements for implementing complex, custom digital functions and control logic.
• Embedded Memory — Approximately 2.56 Mbits of on‑chip RAM (total RAM bits: 2,562,048) to support data buffering, state storage, and local memory requirements.
• I/O Resources — 310 general I/O pins to interface with peripherals, sensors, and external logic on compact PCBs.
• Power — Optimized for operation within a 1.16 V to 1.24 V supply range to match system power rails.
• Package & Mounting — 672‑ball BGA package (supplier device package: 672‑FBGA, 27×27) designed for surface‑mount assembly on modern PCB layouts.
• Temperature & Grade — Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Compliance — RoHS‑compliant manufacturing status.

Typical Applications

• Custom digital logic — Implement application‑specific processors, controllers, or glue logic using the device’s 49,888 logic elements.
• Memory‑centric functions — Use approximately 2.56 Mbits of embedded RAM for buffering, packet storage, or state machines.
• I/O‑intensive interfaces — Leverage 310 I/O pins for multi‑channel sensing, peripheral connectivity, or board‑level signal aggregation.
• Compact surface‑mount designs — 672‑BGA (27×27) packaging enables high‑density PCB layouts where board space is constrained.

Unique Advantages

• High logic density: 49,888 logic elements allow implementation of complex, multi‑function designs without external programmable logic.
• Significant embedded memory: Approximately 2.56 Mbits of on‑chip RAM reduces dependence on off‑chip memory for many buffering and storage needs.
• Generous I/O count: 310 I/O pins provide design flexibility for connecting multiple peripherals and interfaces.
• Compact BGA footprint: The 672‑FBGA (27×27) package supports high‑density board integration while maintaining a surface‑mount assembly profile.
• Low‑voltage operation: Narrow 1.16 V–1.24 V supply range simplifies power‑rail design for systems targeting this voltage domain.
• RoHS compliant: Meets RoHS requirements for lead‑free manufacturing processes.

Why Choose EP4CGX50DF27C6N?

The EP4CGX50DF27C6N positions itself as a balanced, commercial‑grade FPGA option for designs that require substantial logic resources, a meaningful amount of on‑chip RAM, and extensive I/O in a compact surface‑mount package. Its combination of 49,888 logic elements, approximately 2.56 Mbits of embedded memory, and 310 I/O pins makes it suitable for engineers building consolidated, space‑efficient digital systems.

With RoHS compliance, a defined operating voltage window, and a commercial temperature grade, this Cyclone® IV GX device offers a clear specification set for procurement and integration into a wide range of board‑level designs where those parameters align with project requirements.

Request a quote or submit a pricing and availability inquiry for EP4CGX50DF27C6N today to evaluate it for your next design.